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CC2543RHMT

Texas Instruments

CC2543RHMT by Texas Instruments

CC2543RHMT by Texas Instruments is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with supply voltages of 2-3.6 V. Ideal for industrial applications requiring low-profile surface-mount ICs.

Median Price

$4.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6 parts In-Stock

1+ parts

$4.950

100+ parts

-

1k+ parts

$3.330

10k+ parts

$3.122

6

$4.950

-

$3.330

$3.122

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,073 parts In-Stock

1+ parts

$3.287

100+ parts

-

1k+ parts

-

10k+ parts

-

1,073

$3.287

-

-

-

Vyrian

USA . 2,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,041

-

-

-

-

Contempo Components LLC

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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11

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,294 parts In-Stock

1+ parts

$3.114

100+ parts

-

1k+ parts

-

10k+ parts

-

4,294

$3.114

-

-

-

Native Components

USA . 319 parts In-Stock

1+ parts

$8.215

100+ parts

-

1k+ parts

-

10k+ parts

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319

$8.215

-

-

-

Northwest PG Solutions

USA . 2,011 parts In-Stock

1+ parts

$9.037

100+ parts

$8.133

1k+ parts

-

10k+ parts

-

2,011

$9.037

$8.133

-

-

Corohmni

South Africa . 2,991 parts In-Stock

1+ parts

$18.903

100+ parts

-

1k+ parts

-

10k+ parts

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2,991

$18.903

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Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

$69.049

100+ parts

-

1k+ parts

-

10k+ parts

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1,934

$69.049

-

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ChromeModa Solutions

Germany . 2,560 parts In-Stock

1+ parts

$77.583

100+ parts

$63.618

1k+ parts

-

10k+ parts

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2,560

$77.583

$63.618

-

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IDEA Electronic Components Group

UK . 1,880 parts In-Stock

1+ parts

$77.583

100+ parts

$73.704

1k+ parts

$69.825

10k+ parts

-

1,880

$77.583

$73.704

$69.825

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Lixinc

USA . 3,660 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,660

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-

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,500

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DigiPath Technology Company

USA . 1,967 parts In-Stock

1+ parts

-

100+ parts

$69.949

1k+ parts

-

10k+ parts

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1,967

-

$69.949

-

-

Overview

Experience top-of-the-line performance with the CC2543RHMT by Texas Instruments, a leading manufacturer in the industry. This versatile microprocessor circuit boasts a wide range of applications, ensuring that it meets your specific needs with ease. From its durable plastic/epoxy package body material to its industrial temperature grade, this chip carrier offers unparalleled value and reliability. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, and unlock endless possibilities with the CC2543RHMT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product is reliable in various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for different voltage requirements.

Package Shape: SQUARE

The square shape of the package provides a compact form factor, ideal for applications where space is limited.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options allows for flexibility in design and compatibility with different voltage standards.

No. of Terminals: 32

Having a high number of terminals provides a wide range of connectivity options, enabling the product to interface with various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer efficient heat dissipation and space-saving benefits in compact designs.

Minimum Supply Voltage: 2 V

The low minimum supply voltage allows for operation in scenarios where power input may fluctuate or be limited, ensuring reliable performance in various conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising functionality, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the product to function in extreme cold conditions, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, reducing the risk of signal interference and ensuring consistent performance.

Maximum Seated Height: 0.9 mm

With a low maximum seated height, this product is suitable for compact designs where space constraints are a consideration.

Width: 5 mm

The compact width dimension allows for easy integration into circuit layouts and facilitates efficient routing of signals in tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly without compromising the integrity of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables reliable soldering and assembly processes, ensuring the product's durability.

Length: 5 mm

The compact length dimension contributes to the overall small form factor of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product is designed to operate reliably in harsh environmental conditions, making it suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for complex applications that require high-speed data processing.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Terminal Form: NO LEAD

The use of no-lead terminal forms eliminates the risk of lead contamination and ensures compliance with environmental regulations, making it a sustainable choice.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage provides a stable operating voltage for the product, ensuring consistent performance and protection against voltage fluctuations.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, this product allows for high-density mounting, enabling compact and space-saving designs in electronic circuits.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that this product has moderate sensitivity to moisture, requiring standard handling procedures to maintain performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC2543RHMT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CC2543RHMT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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