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CC2540TF256RHAR

Texas Instruments

CC2540TF256RHAR by Texas Instruments

CC2540TF256RHAR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 8192 RAM Bytes, SPI, USART, and USB compatibility. Operating in automotive-grade conditions (-40 to 125 °C), it features a 3 V supply voltage range and comes in a SQUARE package style with 40 terminals for various applications.

Median Price

$5.156

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 254,679 parts In-Stock

1+ parts

$3.971

100+ parts

$3.237

1k+ parts

$2.158

10k+ parts

-

254,679

$3.971

$3.237

$2.158

-

DigiKey

USA . 9,846 parts In-Stock

1+ parts

$6.340

100+ parts

$4.794

1k+ parts

$4.218

10k+ parts

$4.019

9,846

$6.340

$4.794

$4.218

$4.019

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,804 parts In-Stock

1+ parts

$3.772

100+ parts

-

1k+ parts

-

10k+ parts

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3,804

$3.772

-

-

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Vyrian

USA . 2,342 parts In-Stock

1+ parts

$3.971

100+ parts

-

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-

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2,342

$3.971

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-

-

Chip Stock

USA . 10,000 parts In-Stock

1+ parts

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ComSIT USA

USA . 9,995 parts In-Stock

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9,995

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,444 parts In-Stock

1+ parts

$3.574

100+ parts

-

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-

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3,444

$3.574

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-

-

Native Components

USA . 469 parts In-Stock

1+ parts

$5.490

100+ parts

-

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469

$5.490

-

-

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Parana Technologies

USA . 167 parts In-Stock

1+ parts

$24.245

100+ parts

-

1k+ parts

$24.906

10k+ parts

-

167

$24.245

-

$24.906

-

DigiPath Technology Company

USA . 669 parts In-Stock

1+ parts

$26.697

100+ parts

$24.561

1k+ parts

-

10k+ parts

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669

$26.697

$24.561

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-

ChromeModa Solutions

Germany . 3,013 parts In-Stock

1+ parts

$27.242

100+ parts

$22.338

1k+ parts

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3,013

$27.242

$22.338

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IDEA Electronic Components Group

UK . 1,048 parts In-Stock

1+ parts

$27.242

100+ parts

$25.880

1k+ parts

$24.518

10k+ parts

-

1,048

$27.242

$25.880

$24.518

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$44.471

100+ parts

$40.469

1k+ parts

$36.466

10k+ parts

-

1,000

$44.471

$40.469

$36.466

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Corohmni

South Africa . 5,122 parts In-Stock

1+ parts

$82.108

100+ parts

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5,122

$82.108

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QUARKTWIN TECHNOLOGY LTD

USA . 21,921 parts In-Stock

1+ parts

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21,921

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Lixinc

USA . 14,698 parts In-Stock

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14,698

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Futuretech Components

Singapore . 12,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,486 parts In-Stock

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5,486

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Kepictronics

USA . 4,999 parts In-Stock

1+ parts

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4,999

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Alle Elektronik GmbH

Germany . 3,657 parts In-Stock

1+ parts

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3,657

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Metaverse IC Inc.

Canada . 2,233 parts In-Stock

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2,233

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Northwest PG Solutions

USA . 443 parts In-Stock

1+ parts

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$5.380

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443

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$5.380

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Perfect Parts

USA . 1 parts In-Stock

1+ parts

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1

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Overview

Experience unmatched quality and reliability with the Texas Instruments CC2540TF256RHAR, a cutting-edge product in the category of Other Function uPs, uCs & Peripheral ICs. Designed with precision and expertise, this chip carrier boasts a wide range of applications in various industries. From automotive to consumer electronics, this versatile device offers unparalleled value and benefits to customers. Trust in Texas Instruments for top-notch performance and innovative solutions that cater to your specific needs. Elevate your projects with the CC2540TF256RHAR and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for versatile power supply options, accommodating a range of different applications.

Minimum Supply Voltage: 2 V

Can operate at lower voltages, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Capable of functioning under high temperatures, making it suitable for various environments and applications.

RAM Bytes: 8192

Provides a large memory capacity for storing and processing data, enhancing the performance of the IC.

Bus Compatibility: SPI; USART; USB

Offers versatile communication interfaces, enabling seamless integration with different devices and systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC2540TF256RHAR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

SPI; USART; USB

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

21

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

CC2540TF256RHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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