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CC2540F256RHAT

Texas Instruments

CC2540F256RHAT by Texas Instruments

CC2540F256RHAT by Texas Instruments is a 40-terminal microprocessor circuit with 8192 bytes of RAM. It operates b/w -40 to 85°C, compatible with SPI, USART, and USB buses. Ideal for industrial applications requiring comparators and timers in a compact square package.

Median Price

$5.554

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 75,734 parts In-Stock

1+ parts

$4.309

100+ parts

$3.513

1k+ parts

$2.342

10k+ parts

-

75,734

$4.309

$3.513

$2.342

-

DigiKey

USA . 2,308 parts In-Stock

1+ parts

$6.800

100+ parts

$5.146

1k+ parts

$4.601

10k+ parts

$4.398

2,308

$6.800

$5.146

$4.601

$4.398

Mouser Electronics

USA . 695 parts In-Stock

1+ parts

$6.800

100+ parts

$5.150

1k+ parts

$4.040

10k+ parts

-

695

$6.800

$5.150

$4.040

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Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$3.650

1k+ parts

$3.260

10k+ parts

$3.070

30

-

$3.650

$3.260

$3.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,571 parts In-Stock

1+ parts

$3.344

100+ parts

-

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3,571

$3.344

-

-

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Vyrian

USA . 4,012 parts In-Stock

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$3.520

100+ parts

-

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4,012

$3.520

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Chip Stock

USA . 87,505 parts In-Stock

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87,505

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Bristol Electronics

USA . 45 parts In-Stock

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45

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,429 parts In-Stock

1+ parts

$3.168

100+ parts

-

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2,429

$3.168

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-

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Native Components

USA . 157 parts In-Stock

1+ parts

$9.065

100+ parts

-

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157

$9.065

-

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Northwest PG Solutions

USA . 73 parts In-Stock

1+ parts

$9.971

100+ parts

$8.974

1k+ parts

-

10k+ parts

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73

$9.971

$8.974

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Corohmni

South Africa . 28 parts In-Stock

1+ parts

$31.081

100+ parts

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28

$31.081

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Parana Technologies

USA . 2,109 parts In-Stock

1+ parts

$34.804

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2,109

$34.804

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DigiPath Technology Company

USA . 2,227 parts In-Stock

1+ parts

$38.324

100+ parts

$35.258

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2,227

$38.324

$35.258

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IDEA Electronic Components Group

UK . 1,090 parts In-Stock

1+ parts

$39.106

100+ parts

$37.151

1k+ parts

$35.195

10k+ parts

-

1,090

$39.106

$37.151

$35.195

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ChromeModa Solutions

Germany . 459 parts In-Stock

1+ parts

$39.106

100+ parts

$32.067

1k+ parts

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459

$39.106

$32.067

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Advanced Electronics

New Zealand . 31 parts In-Stock

1+ parts

$54.077

100+ parts

$49.210

1k+ parts

$44.343

10k+ parts

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31

$54.077

$49.210

$44.343

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Perfect Parts

USA . 23,016 parts In-Stock

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23,016

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Lixinc

USA . 1,636 parts In-Stock

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1,636

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Futuretech Components

Singapore . 400 parts In-Stock

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Kepictronics

USA . 153 parts In-Stock

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153

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Overview

Texas Instruments, a renowned leader in semiconductor manufacturing, presents the CC2540F256RHAT, a cutting-edge microprocessor circuit that offers unmatched reliability and performance. Ideal for a wide range of applications, this chip carrier with heat sink/slug package delivers seamless integration and robust functionality. From comparators to timers, this peripheral IC is designed to meet the diverse needs of industrial environments. Experience the value of top-tier technology with Texas Instruments' CC2540F256RHAT, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for package body, ensuring product longevity.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications with varying voltage requirements.

Package Shape: SQUARE

Compact shape that helps in efficient space utilization on PCB.

Power Supplies (V): 3

Optimal power supply for the device, balancing performance and efficiency.

No. of Terminals: 40

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package styles for improved thermal management and space-saving.

Minimum Supply Voltage: 2 V

Allows operation even at lower voltage levels, enhancing versatility.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high operating temperature requirements.

Minimum Operating Temperature: -40 °C

Works efficiently even in extreme cold conditions, making it versatile.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for terminals.

Terminal Position: QUAD

Optimal terminal positioning for efficient connectivity and signal routing.

Maximum Seated Height: 1 mm

Low profile design for compact and space-saving PCB layouts.

RAM Words: 8

Sufficient memory for data storage and processing in applications.

Width: 6 mm

Compact width for easy integration into PCB designs.

Peripherals: COMPARATORS, TIMER(4)

Integrated peripherals add functionality and versatility to the device.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow during assembly without damaging the device.

Peak Reflow Temperature °C: 260

Allows for high-temperature soldering processes for reliable connections.

Length: 6 mm

Compact length contributing to the overall small form factor of the product.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments with varying temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Advanced peripheral IC type for efficient processing and control capabilities.

RAM Bytes: 8192

Generous RAM capacity for handling complex data processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and reliable performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmental sustainability and safety.

Nominal Supply Voltage: 3 V

Stable and standard supply voltage for consistent performance.

Bus Compatibility: SPI; USART; USB

Multiple bus compatibility for versatile communication options.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs and layout flexibility.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures safe handling and storage of the device during assembly.

No. of I/O Lines: 21

Sufficient I/O lines for data input/output and communication interfaces.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC2540F256RHAT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

SPI; USART; USB

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

21

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Peripherals:

COMPARATORS, TIMER(4)

Trade Compliance

CC2540F256RHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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