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SA3229-E1-T

Onsemi

SA3229-E1-T by Onsemi

SA3229-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. Operating temperature range of 0-40°C makes it suitable for commercial applications. With a nominal voltage of 1.25V, it's ideal for various uPs and uCs functions requiring surface mount technology.

Median Price

$28.460

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 125 parts In-Stock

1+ parts

$22.640

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125

$22.640

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Rochester

USA . 112 parts In-Stock

1+ parts

-

100+ parts

$28.790

1k+ parts

$25.760

10k+ parts

$24.250

112

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$28.790

$25.760

$24.250

Mouser Electronics

USA . 112 parts In-Stock

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$28.130

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112

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$28.130

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Verical

USA . 112 parts In-Stock

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$35.987

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112

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$35.987

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Distributors (In-Stock)

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Digiode

USA . 1,831 parts In-Stock

1+ parts

$21.508

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1,831

$21.508

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Nova Conductors

Japan . 300 parts In-Stock

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$29.104

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300

$29.104

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Vyrian

USA . 2,434 parts In-Stock

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2,434

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Distributors (Availability)

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AZTECH Wire

Italy . 495 parts In-Stock

1+ parts

$7.987

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495

$7.987

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Continental Prestige Electronics

USA . 205 parts In-Stock

1+ parts

$17.910

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205

$17.910

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Ampacity Inc.

Singapore . 18 parts In-Stock

1+ parts

$19.240

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18

$19.240

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Corphita

USA . 1,527 parts In-Stock

1+ parts

$20.376

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1,527

$20.376

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Corohmni

South Africa . 234 parts In-Stock

1+ parts

$22.640

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234

$22.640

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Netroflash

USA . 1,000 parts In-Stock

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$29.104

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1,000

$29.104

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Component Stockers USA

USA . 802 parts In-Stock

1+ parts

$33.180

100+ parts

$31.190

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802

$33.180

$31.190

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Vigor

Singapore . 6,500 parts In-Stock

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6,500

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SupplyDigital Components

Austria . 5,958 parts In-Stock

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Kulean Microsystems

USA . 5,661 parts In-Stock

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5,661

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TANS Electronics

Latvia . 3,909 parts In-Stock

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3,909

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Microchip USA

USA . 3,757 parts In-Stock

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3,757

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Perfect Parts

USA . 3,360 parts In-Stock

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3,360

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Problanco Electronics

Mexico . 2,317 parts In-Stock

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2,317

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UHIMA Technologies

Türkiye . 653 parts In-Stock

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653

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Overview

Elevate your electronic designs with the SA3229-E1-T by Onsemi, a cutting-edge microprocessor circuit that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this chip carrier package is perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. Experience the exceptional value and benefits of this product, from its high performance to its versatile design. Trust Onsemi's reputation for innovation and excellence, and take your projects to the next level with the SA3229-E1-T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto circuit boards.

No. of Terminals: 25

Having a higher number of terminals allows for more connections and functionality within the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the efficiency of the product.

Nominal Supply Voltage: 1.25 V

The low supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SA3229-E1-T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBCC-B25

Length:

5.59 mm

No. of Terminals:

25

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.781 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.18 mm

Peripheral IC Type:

Trade Compliance

SA3229-E1-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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