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SA3230-E1-T

Onsemi

SA3230-E1-T by Onsemi

SA3230-E1-T by Onsemi is a 32-terminal MICROELECTRONIC ASSEMBLY with CMOS technology. Operating temp range: 0-40 °C, supply voltage: 1.25V. Ideal for commercial-grade MICROPROCESSOR CIRCUIT applications requiring surface mount RECTANGULAR package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,238 parts In-Stock

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Vyrian

USA . 1,326 parts In-Stock

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1,326

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Kulean Microsystems

USA . 5,034 parts In-Stock

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TANS Electronics

Latvia . 4,804 parts In-Stock

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SupplyDigital Components

Austria . 4,364 parts In-Stock

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Problanco Electronics

Mexico . 1,243 parts In-Stock

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UHIMA Technologies

Türkiye . 884 parts In-Stock

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Corphita

USA . 646 parts In-Stock

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Corohmni

South Africa . 153 parts In-Stock

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Overview

Elevate your electronic devices with the SA3230-E1-T by Onsemi. Known for their exceptional quality and innovative technology, Onsemi delivers top-of-the-line products that meet the demands of today's fast-paced world. The SA3230-E1-T falls under the category of Other Function uPs,uCs & Peripheral ICs, making it a versatile solution for a wide range of applications. With its surface mount design, compact package style, and reliable CMOS technology, this product offers customers unmatched value, superior performance, and seamless integration. Experience the difference with Onsemi's SA3230-E1-T - the perfect choice for your next project.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly process.

Package Shape: RECTANGULAR

Common shape that fits well in most electronic devices.

No. of Terminals: 32

Provides multiple connection points for interfacing with other components.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Compact size suitable for space-constrained applications.

Maximum Operating Temperature: 40 °C

Ensures reliable performance even in high temperature environments.

Minimum Operating Temperature: 0 °C

Can function in a wide range of temperature conditions.

Maximum Seated Height: 1.777 mm

Low profile design for slim devices.

Width: 3.68 mm

Compact width for fitting into tight spaces.

Length: 6.35 mm

Optimal length for balancing space constraints and functionality.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Provides advanced processing capabilities.

Technology: CMOS

Low power consumption and reliable performance.

Terminal Form: NO LEAD

Reduces the risk of lead contamination and provides a cleaner look.

Nominal Supply Voltage: 1.25 V

Compatible with standard voltage levels and power requirements.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SA3230-E1-T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N32

Length:

6.35 mm

No. of Terminals:

32

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.777 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.68 mm

Peripheral IC Type:

Trade Compliance

SA3230-E1-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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