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SA3291A-E1-T

Onsemi

SA3291A-E1-T by Onsemi

SA3291A-E1-T by Onsemi is a CMOS microprocessor circuit with 32 terminals. It operates b/w 0-40 °C, ideal for commercial applications. With a nominal voltage of 1.25V, it's suitable for various uPs and uCs functions in surface mount assemblies.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,524 parts In-Stock

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Digiode

USA . 1,508 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$9.802

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$8.920

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$8.038

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100

$9.802

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$8.038

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AZTECH Wire

Italy . 835 parts In-Stock

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$19.030

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Kulean Microsystems

USA . 4,312 parts In-Stock

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Problanco Electronics

Mexico . 4,215 parts In-Stock

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Corphita

USA . 2,195 parts In-Stock

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SupplyDigital Components

Austria . 2,077 parts In-Stock

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TANS Electronics

Latvia . 1,826 parts In-Stock

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Vigor

Singapore . 1,458 parts In-Stock

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Microchip USA

USA . 220 parts In-Stock

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UHIMA Technologies

Türkiye . 145 parts In-Stock

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Corohmni

South Africa . 119 parts In-Stock

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Overview

Unleash the power of innovation with the SA3291A-E1-T by Onsemi. As a leader in the industry, Onsemi has crafted a product that combines quality and reliability in one compact package. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this surface mount device offers unmatched performance and efficiency. Discover the value of seamless operation and enhanced functionality with the SA3291A-E1-T, where every terminal is designed to deliver maximum results. Elevate your projects to new heights with Onsemi's cutting-edge technology and superior design.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape provides versatility in placement on circuit boards, allowing for optimal use of space.

No. of Terminals: 32

Having a higher number of terminals allows for more connections and functionalities, making the product versatile and adaptable to different circuit configurations.

Maximum Operating Temperature: 40 °C

The high maximum operating temperature ensures reliable performance even in environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function effectively in a wide range of operating conditions.

Width: 3.68 mm

The compact width allows for space-efficient placement on circuit boards, especially in applications where board real estate is limited.

Length: 6.35 mm

The moderate length provides a balance between space efficiency and ease of handling during assembly.

Nominal Supply Voltage: 1.25 V

The low nominal supply voltage allows for efficient power consumption, making the product suitable for applications where power efficiency is crucial.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SA3291A-E1-T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N32

Length:

6.35 mm

No. of Terminals:

32

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.777 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.68 mm

Peripheral IC Type:

Trade Compliance

SA3291A-E1-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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