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SA3286-E1-T

Onsemi

SA3286-E1-T by Onsemi

SA3286-E1-T by Onsemi is a 16-terminal chip carrier IC with CMOS technology. Operating temp range of 0-40 °C, nominal voltage of 1.25V, ideal for microprocessor circuits in commercial applications. Package size: 5.46mm x 3.15mm x 1.83mm, surface mountable plastic/epoxy body suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,042 parts In-Stock

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Digiode

USA . 969 parts In-Stock

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969

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Kulean Microsystems

USA . 6,515 parts In-Stock

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6,515

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Problanco Electronics

Mexico . 4,839 parts In-Stock

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SupplyDigital Components

Austria . 1,939 parts In-Stock

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1,939

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Corphita

USA . 1,305 parts In-Stock

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1,305

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UHIMA Technologies

Türkiye . 556 parts In-Stock

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556

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Corohmni

South Africa . 425 parts In-Stock

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425

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TANS Electronics

Latvia . 10 parts In-Stock

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Overview

Discover the power of innovation with the SA3286-E1-T by Onsemi. Designed with precision and expertise, this product offers unmatched quality and reliability. Perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this chip carrier package delivers exceptional performance. Experience the value and benefits that Onsemi brings to the table, providing customers with cutting-edge technology and superior functionality. Elevate your projects with the SA3286-E1-T and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor that is easy to integrate into various electronic designs.

No. of Terminals: 16

Having 16 terminals allows for a greater level of connectivity and functionality in the device.

Package Style (Meter): CHIP CARRIER

The chip carrier style is compact and provides good thermal performance, enhancing the overall reliability of the product.

Maximum Operating Temperature: 40 °C

With a maximum operating temperature of 40 °C, this product can perform reliably in a wide range of environments.

Minimum Operating Temperature: 0 °C

The ability to operate at as low as 0 °C ensures functionality even in cold temperature conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and connections, making installation easier.

Maximum Seated Height: 1.83 mm

This low profile design is space-saving and suitable for slim devices or applications with height constraints.

Width: 3.15 mm

The narrow width of 3.15 mm allows for high-density packing on the PCB, maximizing the use of board space.

Length: 5.46 mm

The compact length of 5.46 mm further contributes to space efficiency in the overall system design.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance in standard operating conditions, suitable for most consumer electronics.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integrated microprocessor circuit offers advanced processing capabilities, making the product versatile and suitable for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BUTT

The butt terminal form allows for easy and secure connections, ensuring reliable performance in the system.

Nominal Supply Voltage: 1.25 V

The low nominal supply voltage of 1.25V helps to minimize power consumption and heat generation, contributing to energy efficiency.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SA3286-E1-T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBCC-B16

Length:

5.46 mm

No. of Terminals:

16

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.83 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

3.15 mm

Peripheral IC Type:

Trade Compliance

SA3286-E1-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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