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STM32W108HBU61TR

STMicroelectronics

STM32W108HBU61TR by STMicroelectronics

STM32W108HBU61TR by STMicroelectronics is a 32-bit Cortex-M3 microprocessor with 131072 ROM words and 8192 RAM bytes. It operates in industrial temperatures (-40 to 85 °C) and has a max supply current of 150 mA. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

$5.376

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$4.853

100+ parts

-

1k+ parts

-

10k+ parts

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10

$4.853

-

-

-

Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$5.900

100+ parts

-

1k+ parts

-

10k+ parts

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10

$5.900

-

-

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Verical

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10

-

-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,522 parts In-Stock

1+ parts

$4.543

100+ parts

-

1k+ parts

-

10k+ parts

-

2,522

$4.543

-

-

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.562

100+ parts

-

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650

$5.562

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Vyrian

USA . 8,521 parts In-Stock

1+ parts

-

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8,521

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-

-

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Anansix

USA . 599 parts In-Stock

1+ parts

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599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.060

-

-

-

Corphita

USA . 1,910 parts In-Stock

1+ parts

$4.304

100+ parts

-

1k+ parts

-

10k+ parts

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1,910

$4.304

-

-

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Continental Prestige Electronics

USA . 5,864 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

$5.451

5,864

$5.562

-

-

$5.451

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.562

100+ parts

$5.451

1k+ parts

-

10k+ parts

-

2,000

$5.562

$5.451

-

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Corohmni

South Africa . 5,136 parts In-Stock

1+ parts

$5.563

100+ parts

-

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10k+ parts

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5,136

$5.563

-

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AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$13.414

100+ parts

-

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820

$13.414

-

-

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

1+ parts

$73.318

100+ parts

-

1k+ parts

$65.987

10k+ parts

-

2,077

$73.318

-

$65.987

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MKK Technologies

India . 2,022 parts In-Stock

1+ parts

$137.871

100+ parts

-

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2,022

$137.871

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DigiPath Technology Company

USA . 2,022 parts In-Stock

1+ parts

$137.871

100+ parts

-

1k+ parts

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2,022

$137.871

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QUARKTWIN TECHNOLOGY LTD

USA . 8,869 parts In-Stock

1+ parts

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8,869

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Microchip USA

USA . 4,954 parts In-Stock

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4,954

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Argo Parts USA

USA . 4,465 parts In-Stock

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4,465

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Perfect Parts

USA . 3,360 parts In-Stock

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3,360

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Parana Technologies

USA . 1,604 parts In-Stock

1+ parts

-

100+ parts

$87.663

1k+ parts

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10k+ parts

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1,604

-

$87.663

-

-

Overview

Unleash the power of innovation with the STM32W108HBU61TR by STMicroelectronics. Crafted with precision and expertise, this product offers unmatched quality and reliability. Ideal for a wide range of applications in the category of Other Function uPs,uCs & Peripheral ICs, this cutting-edge device provides exceptional value and benefits to customers. Experience seamless performance, efficiency, and versatility like never before with the STM32W108HBU61TR, setting new standards in the industry. Elevate your projects and unlock endless possibilities with this game-changing solution from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package provides efficient use of space on the circuit board, allowing for compact designs.

Bit Size: 32

The 32-bit size ensures high processing power and performance, suitable for complex applications.

Power Supplies (V): 1.25, 1.8, 2.5/3.3

The multiple voltage options provide flexibility for different power requirements in various applications.

No. of Terminals: 40

The high number of terminals allows for versatile connectivity options, accommodating multiple external devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers efficient heat dissipation and protection, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial environments with varying temperature conditions.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family provides high processing efficiency and performance for demanding tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability, enhancing the product's overall reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient placement on the circuit board, optimizing space usage.

ROM Words: 131072

The high ROM words capacity offers ample storage for program data and instructions, suitable for complex applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of component damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering and component integrity during manufacturing.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes the product suitable for rugged and harsh environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type offers advanced functionality and integration capabilities for sophisticated applications.

RAM Bytes: 8192

The high RAM capacity allows for efficient data processing and storage, ideal for multitasking and data-intensive applications.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed performance, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The no lead terminal form offers improved reliability and performance, reducing the risk of solder joint failure.

Maximum Supply Current: 150 mA

The low maximum supply current consumption helps in minimizing power usage and extending battery life in portable devices.

ROM Programmability: FLASH

The programmable FLASH ROM feature allows for easy and quick updates to the program data, enhancing flexibility and adaptability.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact designs and efficient use of space on the circuit board.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates a level of moisture resistance, ensuring reliability in humid environments.

Speed: 24 rpm

The high speed capability of 24 rpm enables fast data processing and response times, suitable for real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108HBU61TR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

STM32W108HBU61TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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