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STM32W108CBU63

STMicroelectronics

STM32W108CBU63 by STMicroelectronics

STM32W108CBU63 by STMicroelectronics is a 32-bit microprocessor featuring a max supply voltage of 1.32V and an industrial temperature range from -40 °C to 85°C. It offers 131072 ROM words and 8192 RAM bytes, ideal for low-power applications. Its compact design suits various embedded systems requiring efficient processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,973 parts In-Stock

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3,973

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Digiode

USA . 1,720 parts In-Stock

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1,720

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Anansix

USA . 174 parts In-Stock

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174

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IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$38.442

100+ parts

-

1k+ parts

$34.598

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743

$38.442

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$34.598

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Corohmni

South Africa . 1,873 parts In-Stock

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$58.895

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$58.895

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MKK Technologies

India . 2,086 parts In-Stock

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$72.288

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2,086

$72.288

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DigiPath Technology Company

USA . 2,086 parts In-Stock

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$72.288

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2,086

$72.288

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Corphita

USA . 3,611 parts In-Stock

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3,611

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Parana Technologies

USA . 671 parts In-Stock

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$45.964

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$45.964

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Overview

Unlock the potential of your next innovative project with the STM32W108CBU63 from STMicroelectronics. Renowned for unmatched quality and reliability, this cutting-edge microprocessor integrates seamlessly into diverse applications, from industrial automation to IoT devices. With its low power consumption and robust performance, you can achieve optimal efficiency without compromising on speed. Choose STM32W108CBU63 for a trusted solution that enhances your designs and accelerates time-to-market!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient manufacturing processes, making it suitable for compact applications.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage helps in reducing power consumption, leading to longer battery life in portable devices.

Package Shape: SQUARE

A square package shape enables easier PCB layout and uniform distribution of heat, contributing to reliable performance.

Bit Size: 32

With a 32-bit architecture, this product supports complex computations and greater memory access, suitable for advanced applications.

Power Supplies (V): 1.25, 1.8, 2.5/3.3

Multiple voltage supply options provide flexibility in design and integration into various systems.

No. of Terminals: 48

A higher number of terminals allows for more functionality and peripheral connections, enhancing the device's adaptability.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style and thin profile contribute to efficient thermal management and a compact footprint.

Minimum Supply Voltage: 1.18 V

The low minimum voltage allows it to function efficiently in low-power applications, making it ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures ensures reliability in various environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its efficient processing power, making it suitable for embedded applications requiring performance.

Minimum Operating Temperature: -40 °C

Wide temperature range support ensures functionality in extreme environments and reliability in harsh conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and resistance to corrosion, ensuring durable connections.

Terminal Position: QUAD

The quad terminal position enhances stability during soldering and integration, ensuring robust electrical connections.

ROM Words: 131072

Significant ROM capacity allows for substantial program storage, suitable for complex applications.

Maximum Seated Height: 1 mm

The low seated height minimizes space usage on the PCB, facilitating tighter designs.

Width: 7 mm

Compact width allows for efficient placement on boards and compatibility with space-constrained designs.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds helps ensure proper solder joint formation without overheating the components.

Peak Reflow Temperature: 260 °C

High reflow temperature capability ensures compatibility with lead-free soldering processes.

Length: 7 mm

This length complements the width, maintaining a compact form factor, suitable for space-limited applications.

Temperature Grade: INDUSTRIAL

Industrial grade ensures the component is built to withstand tough conditions and prolonged operational reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Designated as a microprocessor, it is well suited for various computing tasks within embedded systems.

RAM Bytes: 8192

Ample RAM supports better performance and complex data handling, enhancing the overall functionality of the application.

Technology: CMOS

CMOS technology allows for lower power consumption and greater efficiency, ideal for long-term use in battery-powered devices.

Terminal Form: NO LEAD

No-lead technology enhances the footprint and integration possibilities, contributing to modern design practices.

Maximum Supply Current: 150 mA

Low maximum supply current reduces overall power needs, making it a good fit for power-sensitive configurations.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage allows compatibility with low-voltage circuits, promoting energy efficiency.

ROM Programmability: FLASH

Flash programmability facilitates easy updates and modifications to firmware, increasing design flexibility.

Terminal Pitch: 0.5 mm

A narrow terminal pitch permits high-density designs, allowing more components in a smaller area.

Moisture Sensitivity Level (MSL): 3

Being MSL 3 means it has moderate sensitivity to moisture, which is manageable with proper handling during assembly.

Speed: 24 rpm

With a speed of 24 rpm, it is suitable for applications needing moderate processing speed, balancing performance and efficiency.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108CBU63 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108CBU63 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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