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STM32TS60ZH6XXY

STMicroelectronics

STM32TS60ZH6XXY by STMicroelectronics

STM32TS60ZH6XXY by STMicroelectronics is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 2.4V to 3.6V, making it ideal for INDUSTRIAL applications requiring high performance in a compact GRID ARRAY package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,251 parts In-Stock

1+ parts

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3,251

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Vyrian

USA . 304 parts In-Stock

1+ parts

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304

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Anansix

USA . 94 parts In-Stock

1+ parts

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94

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,060 parts In-Stock

1+ parts

$76.170

100+ parts

-

1k+ parts

$68.553

10k+ parts

-

2,060

$76.170

-

$68.553

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Corohmni

South Africa . 550 parts In-Stock

1+ parts

$79.854

100+ parts

-

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550

$79.854

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MKK Technologies

India . 362 parts In-Stock

1+ parts

$143.232

100+ parts

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362

$143.232

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-

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DigiPath Technology Company

USA . 362 parts In-Stock

1+ parts

$143.232

100+ parts

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362

$143.232

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Corphita

USA . 1,500 parts In-Stock

1+ parts

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1,500

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Parana Technologies

USA . 347 parts In-Stock

1+ parts

-

100+ parts

$91.072

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347

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$91.072

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Overview

Unlock the power of innovation with the STM32TS60ZH6XXY by STMicroelectronics. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications in various industries, this product provides exceptional value and benefits to customers looking for top-of-the-line functionality and performance. Say goodbye to limitations and hello to endless possibilities with the STM32TS60ZH6XXY.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and makes the product resistant to impact and environmental factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, reducing assembly time and cost.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in application scenarios.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, maximizing component density.

No. of Terminals: 144

With a high number of terminals, this product can support complex circuit configurations and functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch design enhances signal integrity and reduces noise interference, ensuring reliable performance.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage allows for energy-efficient operation and extends the product's battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to perform reliably in industrial settings with potentially high heat environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function effectively in cold environments or during temperature fluctuations.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes, making it user-friendly and convenient for assembly.

Maximum Seated Height: 0.6 mm

The low maximum seated height minimizes the overall profile of the product, allowing for compact designs and space-saving installations.

Width: 7 mm

The compact width of 7 mm contributes to space-efficient PCB layouts and enables the integration of the product into various electronic devices.

Length: 7 mm

The short length of 7 mm further enhances the product's compact form factor, making it suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh environmental conditions and operate reliably in demanding industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC type enhances the product's computational capabilities and enables advanced functionality in electronic systems.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable signal transmission, ensuring stable performance in demanding operational conditions.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on PCBs, facilitating intricate circuit designs and optimizing board space utilization.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32TS60ZH6XXY attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B144

Length:

7 mm

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32TS60ZH6XXY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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