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STM32W108CBU6

STMicroelectronics

STM32W108CBU6 by STMicroelectronics

STM32W108CBU6 by STMicroelectronics is a 32-bit microprocessor featuring a max supply voltage of 1.32V and an industrial temp range of -40 °C to 85°C. It offers 131072 ROM words and 8192 bytes of RAM, ideal for low-power applications. Its compact design suits various embedded systems requiring efficient processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,697 parts In-Stock

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3,697

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Anansix

USA . 2,774 parts In-Stock

1+ parts

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2,774

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Digiode

USA . 777 parts In-Stock

1+ parts

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777

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,146 parts In-Stock

1+ parts

$17.217

100+ parts

-

1k+ parts

$15.495

10k+ parts

-

1,146

$17.217

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$15.495

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Corohmni

South Africa . 1,180 parts In-Stock

1+ parts

$29.970

100+ parts

-

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1,180

$29.970

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MKK Technologies

India . 2,136 parts In-Stock

1+ parts

$32.375

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2,136

$32.375

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DigiPath Technology Company

USA . 2,136 parts In-Stock

1+ parts

$32.375

100+ parts

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2,136

$32.375

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Metaverse IC Inc.

Canada . 9,586 parts In-Stock

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9,586

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Corphita

USA . 2,535 parts In-Stock

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2,535

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Parana Technologies

USA . 308 parts In-Stock

1+ parts

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$20.585

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308

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$20.585

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Overview

Unlock the potential of your next project with the STM32W108CBU6 from STMicroelectronics. Renowned for its excellence in semiconductor innovation, STMicroelectronics delivers unmatched quality and reliability. This compact 32-bit microprocessor is perfect for ultra-low power applications, providing exceptional performance across a wide temperature range. Experience superior efficiency and flexibility, empowering you to create cutting-edge solutions that resonate with your customers.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of space on PCBs, making it ideal for compact electronic devices.

Maximum Supply Voltage: 1.32 V

A low maximum supply voltage ensures reduced power consumption, enhancing the energy efficiency of the overall system.

Package Shape: SQUARE

The square package shape provides a compact footprint while allowing for better thermal management and signal integrity.

Bit Size: 32

The 32-bit architecture enables high processing power and the ability to handle complex calculations and larger data sets.

Power Supplies (V): 2.5/3.3

Support for both 2.5V and 3.3V power supplies offers flexibility for various applications and compatibility with different systems.

No. of Terminals: 48

A higher number of terminals allows for greater connectivity options and integration with a variety of peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers excellent heat dissipation and a low-profile design, suitable for compact designs needing thermal management.

Minimum Supply Voltage: 1.18 V

A low minimum supply voltage allows for operation in low-power applications and contributes to overall energy savings.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this product suitable for industrial applications where heat exposure is common.

CPU Family: CORTEX-M3

The ARM Cortex-M3 core provides high performance with a low power footprint, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, this product is perfect for outdoor or harsh environment applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, enhancing durability and reliability.

Terminal Position: QUAD

Quad terminal positioning improves current flow and signal integrity, contributing to optimal performance.

ROM Words: 131072

A substantial ROM capacity allows for ample firmware storage, supporting complex functionalities and updates.

Maximum Seated Height: 1 mm

This exceptionally low profile is advantageous for designs requiring space-saving components.

Width: 7 mm

The compact width makes it adaptable for various electronic applications without compromising on performance.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures reliable solder connections during assembly processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak temperatures during soldering, ensuring robustness in manufacturing.

Length: 7 mm

A short length enhances compatibility with tight layouts in modern electronic designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates it is built to withstand demanding conditions, suitable for a wide range of applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, it can handle complex tasks efficiently, making it suitable for advanced embedded systems.

RAM Bytes: 8192

The 8KB RAM allows for efficient data handling and processing, enabling responsive performance in applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, perfect for battery-operated applications.

Terminal Form: NO LEAD

No lead terminals help reduce environmental impact and improve compatibility with modern manufacturing practices.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage of 1.25V allows for efficient energy usage, benefiting low-power devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, enhancing versatility and use in dynamic applications.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density layouts, making it suitable for compact designs with space constraints.

Moisture Sensitivity Level (MSL): 3

MSL 3 allows for some level of moisture sensitivity, guiding storage and handling practices to ensure reliability.

Speed: 24 rpm

The specified speed indicates suitable performance levels for processing tasks, ensuring efficiency in various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108CBU6 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108CBU6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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