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STM32W108CBU7

STMicroelectronics

STM32W108CBU7 by STMicroelectronics

STM32W108CBU7 by STMicroelectronics is a 32-bit microprocessor featuring a max supply voltage of 1.32V and an industrial temperature range from -40 °C to 105 °C. It offers 131072 ROM words and 8192 bytes of RAM, ideal for low-power applications. Its compact design suits various embedded systems requiring efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,732 parts In-Stock

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1,732

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Anansix

USA . 1,550 parts In-Stock

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1,550

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Vyrian

USA . 453 parts In-Stock

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453

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,562 parts In-Stock

1+ parts

$24.082

100+ parts

-

1k+ parts

$21.674

10k+ parts

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1,562

$24.082

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$21.674

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MKK Technologies

India . 233 parts In-Stock

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$45.284

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233

$45.284

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DigiPath Technology Company

USA . 233 parts In-Stock

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$45.284

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233

$45.284

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Corohmni

South Africa . 946 parts In-Stock

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$62.309

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946

$62.309

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Parana Technologies

USA . 1,603 parts In-Stock

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$28.794

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$28.794

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Corphita

USA . 1,255 parts In-Stock

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Overview

Elevate your designs with the STM32W108CBU7 from STMicroelectronics, where cutting-edge technology meets unmatched reliability. This robust microprocessor seamlessly integrates into various applications, from industrial automation to IoT devices, delivering exceptional performance in extreme conditions. With its low power consumption and versatile features, you'll enjoy enhanced efficiency and scalability, empowering you to innovate confidently and stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 1.32 V

A low maximum supply voltage helps reduce power consumption, making it ideal for battery-operated devices.

Package Shape: SQUARE

The square package shape offers better thermal performance and uniformity in assembly, which improves reliability.

Bit Size: 32

A 32-bit architecture allows for more complex calculations and higher processing capabilities, beneficial for demanding applications.

Power Supplies (V): 2.5/3.3

Supports dual power supply voltages, providing flexibility for integration into various systems and enhancing compatibility.

No. of Terminals: 48

A higher number of terminals allows for more connections, leading to greater functionality and diverse interfacing options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style is designed for efficient heat dissipation and a slim profile, allowing for high-performance in compact designs.

Minimum Supply Voltage: 1.18 V

The low minimum supply voltage enhances energy efficiency, allowing for operation in low-power environments.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability in harsh environments, suitable for industrial applications.

CPU Family: CORTEX-M3

Based on a popular ARM architecture, the Cortex-M3 family provides a good balance of performance and energy efficiency, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperatures makes this product suitable for outdoor and rugged applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reliability of the connection, ensuring better performance over time.

Terminal Position: QUAD

Quad terminal positioning allows for easier and more efficient mounting on the PCB, reducing assembly time.

ROM Words: 131072

Ample ROM provides enough storage for applications, enabling more complex programming and versatility in software design.

Maximum Seated Height: 1 mm

A very low height profile allows for integration into slim devices, making it ideal for modern compact electronic designs.

Width: 7 mm

A compact width supports miniaturization, contributing to the development of smaller devices without sacrificing performance.

Maximum Time At Peak Reflow Temperature (s): 40

Supports a longer reflow process, improving soldering quality and reliability during manufacturing.

Peak Reflow Temperature °C: 260

A high peak reflow temperature tolerance ensures compatibility with a variety of soldering processes.

Length: 7 mm

With a 7 mm length, this component is easily integrable into compact designs without compromising other functionalities.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, making it suitable for safety-critical applications in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it delivers the capability to process data efficiently and control various peripherals.

RAM Bytes: 8192

Sufficient RAM capacity allows for smooth multitasking and processing power for complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, which is beneficial for battery-led and sensitive applications.

Terminal Form: NO LEAD

No-lead design reduces the risk of soldering defects and improves the overall reliability of the device in various applications.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA supports a wide range of functionalities while maintaining efficient power management.

Nominal Supply Voltage: 1.25 V

A low nominal supply voltage optimizes energy usage and extends the battery life in portable applications.

ROM Programmability: FLASH

Flash memory allows for easy updates and program changes, enhancing the product's adaptability and user experience.

Terminal Pitch: 0.5 mm

A smaller terminal pitch enables a higher density design, accommodating more connections within limited PCB space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 suggests a moderate sensitivity to moisture, allowing for reasonable handling and assembly conditions.

Speed: 24 rpm

A speed of 24 rpm indicates moderate processing capabilities, suitable for various embedded applications requiring efficient performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108CBU7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108CBU7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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