Loading...

STM32W108C8U7

STMicroelectronics

STM32W108C8U7 by STMicroelectronics

STM32W108C8U7 by STMicroelectronics is a MICROPROCESSOR CIRCUIT with CMOS tech. It operates b/w -40 to 105 °C, with supply voltage range of 1.18-1.32 V. Ideal for industrial applications requiring low power consumption and compact design in a SQUARE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,174

-

-

-

-

Digiode

USA . 465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

465

-

-

-

-

Anansix

USA . 384 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

384

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 242 parts In-Stock

1+ parts

$41.868

100+ parts

-

1k+ parts

$37.681

10k+ parts

-

242

$41.868

-

$37.681

-

Corohmni

South Africa . 147 parts In-Stock

1+ parts

$70.017

100+ parts

-

1k+ parts

-

10k+ parts

-

147

$70.017

-

-

-

MKK Technologies

India . 519 parts In-Stock

1+ parts

$78.731

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$78.731

-

-

-

DigiPath Technology Company

USA . 519 parts In-Stock

1+ parts

$78.731

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$78.731

-

-

-

Corphita

USA . 2,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,957

-

-

-

-

Parana Technologies

USA . 1,773 parts In-Stock

1+ parts

-

100+ parts

$50.060

1k+ parts

-

10k+ parts

-

1,773

-

$50.060

-

-

Overview

Unlock endless possibilities with the STM32W108C8U7 by STMicroelectronics, a cutting-edge microprocessor circuit that offers unparalleled performance and reliability. Designed with precision and expertise, this chip carrier features a very thin profile and industrial-grade temperature range, ensuring optimal functionality in any application. Whether you're creating smart home devices, wearable technology, or IoT solutions, the STM32W108C8U7 delivers outstanding value, efficiency, and versatility to meet all your needs. Experience innovation like never before with STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into circuit boards, saving time and reducing overall manufacturing costs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32 V ensures stable operation even under varying input power conditions.

Package Shape: SQUARE

The square package shape helps in optimizing the use of space on the circuit board, especially in compact designs.

No. of Terminals: 48

Having 48 terminals provides a good number of connection points, allowing for versatile functionality and connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.18 V

The low minimum supply voltage of 1.18 V allows for energy-efficient operation and reduces power consumption.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 105 °C ensures the product can function in extreme temperature conditions without any issues.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, minimizing the risk of signal interference and improving overall performance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a compact and slim design, ideal for space-sensitive applications.

Width: 7 mm

The narrow width of 7 mm contributes to the overall compactness of the product, making it suitable for smaller electronic devices.

Length: 7 mm

The short length of 7 mm further enhances the product's compact form factor, enabling it to be integrated into tight spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures the product can withstand rugged environmental conditions typically found in industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit peripheral IC type, this product offers advanced processing capabilities and enhanced functionality for various applications requiring complex data processing.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product's reliability, reduces potential soldering issues, and simplifies the assembly process.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage of 1.25 V ensures stable and efficient operation, providing a balance between high and low voltage input requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and compact PCB designs, making the product suitable for space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108C8U7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108C8U7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19