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STM32W108C8U6

STMicroelectronics

STM32W108C8U6 by STMicroelectronics

STM32W108C8U6 by STMicroelectronics is a 32-bit microprocessor with Cortex-M3 CPU family. It operates at speeds up to 24 rpm, has 65536 ROM words, and 8192 RAM bytes. Ideal for industrial applications requiring a temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,795 parts In-Stock

1+ parts

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3,795

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Digiode

USA . 1,613 parts In-Stock

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1,613

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Anansix

USA . 1,010 parts In-Stock

1+ parts

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1,010

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,201 parts In-Stock

1+ parts

$21.905

100+ parts

-

1k+ parts

$19.715

10k+ parts

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2,201

$21.905

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$19.715

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MKK Technologies

India . 80 parts In-Stock

1+ parts

$41.191

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80

$41.191

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DigiPath Technology Company

USA . 80 parts In-Stock

1+ parts

$41.191

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80

$41.191

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Corohmni

South Africa . 583 parts In-Stock

1+ parts

$55.703

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583

$55.703

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Corphita

USA . 1,792 parts In-Stock

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1,792

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Parana Technologies

USA . 743 parts In-Stock

1+ parts

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$26.191

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743

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$26.191

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Overview

Discover the STM32W108C8U6 by STMicroelectronics, a superior choice for your uPs and uCs needs. With cutting-edge technology and reliable performance, this product offers unmatched value and benefits to customers. From its industrial-grade temperature range to its advanced Cortex-M3 CPU family, the STM32W108C8U6 is designed to excel in various applications. Trust STMicroelectronics for quality products that deliver exceptional results. Unlock the potential of your projects with the STM32W108C8U6 today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits, making this product convenient for manufacturing.

Maximum Supply Voltage: 1.32 V

With a relatively high maximum supply voltage, this product can handle higher power applications efficiently.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the circuit board and making it suitable for applications with limited space.

Bit Size: 32

A 32-bit architecture provides better performance and processing capabilities compared to lower bit sizes, making this product suitable for tasks requiring more complex computations.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for flexibility in different system configurations and power requirements.

No. of Terminals: 48

Having 48 terminals provides a good number of connection points for interfacing with other components, enabling versatile use in various electronic systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer flexibility in thermal management and physical size, catering to different design requirements and heat dissipation needs.

Minimum Supply Voltage: 1.18 V

The low minimum supply voltage allows for efficient operation even at lower power levels, increasing energy efficiency in the system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, ensuring reliability in harsh operating conditions.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 family indicates a reliable and established microcontroller architecture, offering proven performance and functionality.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes this product suitable for use in cold environments or industrial applications where temperature fluctuations are common.

Terminal Position: QUAD

The quad terminal position layout facilitates easier and more organized connections, simplifying the integration of this product into the overall system design.

ROM Words: 65536

With a large ROM capacity of 65536 words, this product can store significant amounts of program data, allowing for more complex and feature-rich applications.

Maximum Seated Height: 1 mm

A low maximum seated height enables a slim profile design, ideal for applications where space constraints or height restrictions are a concern.

Width: 7 mm

The compact width dimension contributes to the overall space-saving design, making this product suitable for compact electronic devices or systems.

Length: 7 mm

Similar to width, the 7 mm length dimension further enhances the compact form factor of this product, allowing for easy integration into small devices or tight spaces.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh environments with wide temperature variations, making this product suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for tasks requiring high computational power and control functions.

RAM Bytes: 8192

With 8192 bytes of RAM, this product can efficiently handle data storage and processing, enabling multitasking and memory-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of this product in various electronic applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and improves reliability, offering a more robust connection for stable operation.

Nominal Supply Voltage: 1.25 V

A nominal supply voltage of 1.25 V ensures stable and efficient operation within the specified voltage range, maximizing performance and energy efficiency.

ROM Programmability: FLASH

Flash programmability enables easy and quick reprogramming of the ROM, allowing for flexibility in updating firmware or software without replacing the entire chip.

Terminal Pitch: 0.5 mm

The fine 0.5 mm terminal pitch provides precise and compact connections, improving the overall reliability and signal integrity of the system.

Speed: 24 rpm

With a speed of 24 rpm, this product can provide fast and efficient processing capabilities, enhancing the overall performance of the electronic system.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108C8U6 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108C8U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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