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STM32W108C8U74

STMicroelectronics

STM32W108C8U74 by STMicroelectronics

STM32W108C8U74 by STMicroelectronics is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 105 °C, with a supply voltage of 1.18-1.32 V. Ideal for applications requiring low power consumption and compact design due to its SQUARE shape and very thin profile CHIP CARRIER package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,069 parts In-Stock

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3,069

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Anansix

USA . 2,798 parts In-Stock

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2,798

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Digiode

USA . 2,439 parts In-Stock

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2,439

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 275 parts In-Stock

1+ parts

$38.238

100+ parts

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275

$38.238

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IDEA Electronic Components Group

UK . 2,084 parts In-Stock

1+ parts

$65.169

100+ parts

-

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$58.652

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2,084

$65.169

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$58.652

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MKK Technologies

India . 287 parts In-Stock

1+ parts

$122.546

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287

$122.546

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DigiPath Technology Company

USA . 287 parts In-Stock

1+ parts

$122.546

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287

$122.546

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Parana Technologies

USA . 2,019 parts In-Stock

1+ parts

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$77.920

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2,019

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$77.920

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Corphita

USA . 993 parts In-Stock

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993

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Overview

Unlock the potential of your next project with the STM32W108C8U74 by STMicroelectronics. Crafted by a trusted manufacturer known for quality and innovation, this versatile microprocessor circuit offers unrivaled performance and reliability in a compact square package. Ideal for a wide range of applications, from IoT devices to industrial automation, this chip carrier boasts a very thin profile and impressive temperature grade for seamless integration. Experience the benefits of cutting-edge technology with the STM32W108C8U74 and take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 1.32 V

This high maximum supply voltage allows for versatile use in a variety of applications.

Package Shape: SQUARE

Square package shape ensures uniform and compact design, optimizing use of space on the circuit board.

No. of Terminals: 48

With a high number of terminals, this product offers plenty of connectivity options for various components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and overall compact design.

Minimum Supply Voltage: 1.18 V

Low minimum supply voltage ensures efficient power consumption and reliable operation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for use in industrial settings and ensures durability under harsh conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can perform reliably even in extreme cold environments.

Terminal Position: QUAD

Quad terminal position offers efficient connectivity options with multiple components, enhancing versatility.

Maximum Seated Height: 1 mm

Low seated height allows for a slim and compact design, suitable for space-constrained applications.

Width: 7 mm

Compact width ensures a space-saving design on the circuit board.

Length: 7 mm

Compact length ensures a space-saving design on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced computing capabilities suitable for complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making it suitable for a wide range of applications.

Terminal Form: NO LEAD

No lead terminal form enhances reliability and efficiency in connectivity.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage ensures consistent performance and reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density integration on the circuit board, enabling compact design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108C8U74 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108C8U74 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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