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STM32W108C8U73

STMicroelectronics

STM32W108C8U73 by STMicroelectronics

STM32W108C8U73 by STMicroelectronics is a MICROPROCESSOR CIRCUIT with CMOS tech. It operates b/w -40 to 105 °C, with supply voltage range of 1.18-1.32 V. Ideal for industrial applications due to its QUAD terminal position and compact SQUARE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,021 parts In-Stock

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Anansix

USA . 2,198 parts In-Stock

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2,198

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Digiode

USA . 777 parts In-Stock

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777

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Distributors (Availability)

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Corohmni

South Africa . 696 parts In-Stock

1+ parts

$18.311

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696

$18.311

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IDEA Electronic Components Group

UK . 1,766 parts In-Stock

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$68.997

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$62.098

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1,766

$68.997

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$62.098

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MKK Technologies

India . 928 parts In-Stock

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$129.745

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928

$129.745

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DigiPath Technology Company

USA . 928 parts In-Stock

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$129.745

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928

$129.745

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Parana Technologies

USA . 1,145 parts In-Stock

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$82.497

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1,145

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$82.497

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Corphita

USA . 590 parts In-Stock

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590

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Overview

Unleash the power of innovation with the STM32W108C8U73 by STMicroelectronics. Crafted with precision and expertise, this versatile microprocessor circuit offers unmatched performance and reliability. Whether you're designing IoT devices, smart home solutions, or industrial automation systems, this cutting-edge technology will elevate your projects to new heights. Experience seamless integration, superior quality, and exceptional value with the STM32W108C8U73. Elevate your designs and stay ahead of the competition with STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on a PCB, saving time and space.

Maximum Supply Voltage: 1.32 V

Provides a sufficient amount of power for the device to function optimally.

Package Shape: SQUARE

Square shape allows for easy placement and alignment on the PCB.

No. of Terminals: 48

Provides a good number of connection points for various functions and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This combination of package styles allows for efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 1.18 V

Allows the product to operate efficiently even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Can operate in high-temperature environments without any issues.

Minimum Operating Temperature: -40 °C

Operates effectively even in very low-temperature conditions.

Terminal Position: QUAD

Quad terminal position allows for easy connections and wiring.

Maximum Seated Height: 1 mm

Low seated height saves space on the PCB and allows for a compact design.

Width: 7 mm

Compact width allows for efficient placement on the PCB.

Length: 7 mm

Compact length also contributes to space-saving design.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments where temperature variations are common.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes advanced microprocessor circuit for efficient and high-speed processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

No lead terminals are more reliable and durable compared to traditional leaded terminals.

Nominal Supply Voltage: 1.25 V

Optimal nominal supply voltage for efficient operation.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for compact and efficient wiring connections.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108C8U73 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108C8U73 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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