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STM32W108C8U63

STMicroelectronics

STM32W108C8U63 by STMicroelectronics

STM32W108C8U63 by STMicroelectronics is a 32-bit CORTEX-M3 CPU with 65536 ROM words and 8192 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.18-1.32 V, making it ideal for industrial MICROPROCESSOR CIRCUIT applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,967 parts In-Stock

1+ parts

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4,967

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Vyrian

USA . 4,945 parts In-Stock

1+ parts

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4,945

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Anansix

USA . 1,304 parts In-Stock

1+ parts

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1,304

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,641 parts In-Stock

1+ parts

$55.329

100+ parts

-

1k+ parts

$49.796

10k+ parts

-

1,641

$55.329

-

$49.796

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Corohmni

South Africa . 2,100 parts In-Stock

1+ parts

$68.040

100+ parts

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2,100

$68.040

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MKK Technologies

India . 1,034 parts In-Stock

1+ parts

$104.042

100+ parts

-

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1,034

$104.042

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DigiPath Technology Company

USA . 1,034 parts In-Stock

1+ parts

$104.042

100+ parts

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1,034

$104.042

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Corphita

USA . 2,446 parts In-Stock

1+ parts

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2,446

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Parana Technologies

USA . 1,117 parts In-Stock

1+ parts

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$66.154

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1,117

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$66.154

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Overview

Elevate your projects with the STM32W108C8U63 by STMicroelectronics. Known for their top-quality products, STMicroelectronics delivers exceptional performance and reliability in every component. This versatile microprocessor circuit is perfect for a wide range of applications, from IoT devices to industrial automation. With its advanced features and robust design, the STM32W108C8U63 provides unmatched value and benefits to customers looking for a powerful solution to drive innovation forward. Choose STMicroelectronics for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, saving time and reducing production costs.

Maximum Supply Voltage: 1.32 V

Operating within a safe maximum supply voltage range ensures the longevity and stability of the product.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, ideal for compact designs.

Bit Size: 32

A 32-bit architecture enables the product to handle complex operations and calculations efficiently.

Power Supplies (V): 2.5/3.3

Compatibility with multiple power supply voltages provides flexibility in system integration.

No. of Terminals: 48

With 48 terminals, the product offers a wide range of connectivity options for various external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 1.18 V

Having a minimum supply voltage of 1.18 V allows for operation in low-power scenarios, conserving energy.

Maximum Operating Temperature: 85 °C

Capable of operating at up to 85 °C, making it suitable for industrial environments where temperature fluctuations occur.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 CPU family ensures compatibility and support for a wide range of development tools and software.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product can withstand extreme cold conditions without performance degradation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and promotes good solderability during assembly.

Terminal Position: QUAD

QUAD terminal position enhances stability and reliability of connections on the product, reducing the risk of signal interference.

ROM Words: 65536

A ROM capacity of 65536 words ensures sufficient storage for program code and data, allowing for complex applications to be executed smoothly.

Maximum Seated Height: 1 mm

The compact maximum seated height of 1 mm enables the product to be integrated into slim and space-constrained designs.

Width: 7 mm

With a width of 7 mm, the product can fit into narrow spaces on a circuit board, increasing design flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

The product can withstand peak reflow temperatures for up to 40 seconds, ensuring proper solder joint formation during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C allows for reliable and durable soldering of the product onto the circuit board.

Length: 7 mm

With a length of 7 mm, the product maintains a compact form factor, suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliable operation in harsh environments with temperature fluctuations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit peripheral IC type, the product can handle various input/output functions efficiently, enhancing overall system performance.

RAM Bytes: 8192

With 8192 bytes of RAM, the product provides ample memory for temporary data storage and efficient processing of tasks.

Technology: CMOS

Utilizing CMOS technology enables the product to operate at low power consumption levels while maintaining high-speed performance.

Terminal Form: NO LEAD

A no-lead terminal form simplifies the assembly process, reducing the risk of solder bridges and ensuring proper electrical connections.

Nominal Supply Voltage: 1.25 V

Operating at a nominal supply voltage of 1.25 V provides a balance between power efficiency and performance for the product.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the firmware and software of the product, ensuring adaptability to changing requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the product offers fine-pitch connections for high-density integration on a circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand exposure to moderate levels of moisture during assembly and operation.

Speed: 24 rpm

Operating at a speed of 24 rpm, the product can execute instructions and process data swiftly, supporting real-time applications effectively.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108C8U63 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108C8U63 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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