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STM32W108CBU62

STMicroelectronics

STM32W108CBU62 by STMicroelectronics

STM32W108CBU62 by STMicroelectronics is a 32-bit microprocessor featuring a max supply voltage of 1.32V and an industrial temperature range from -40 °C to 85°C. It offers 131072 ROM words and 8192 bytes of RAM, ideal for low-power applications. Its compact design (7mm x 7mm) suits various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,761 parts In-Stock

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3,761

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Digiode

USA . 3,089 parts In-Stock

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3,089

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Anansix

USA . 2,035 parts In-Stock

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2,035

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Distributors (Availability)

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Corohmni

South Africa . 33 parts In-Stock

1+ parts

$24.896

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33

$24.896

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IDEA Electronic Components Group

UK . 306 parts In-Stock

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$56.144

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$50.530

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306

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$50.530

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MKK Technologies

India . 2,173 parts In-Stock

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$105.575

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2,173

$105.575

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DigiPath Technology Company

USA . 2,173 parts In-Stock

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$105.575

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$105.575

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Corphita

USA . 3,974 parts In-Stock

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Parana Technologies

USA . 653 parts In-Stock

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$67.129

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Overview

Elevate your innovations with the STM32W108CBU62 from STMicroelectronics—where cutting-edge technology meets unparalleled reliability. Designed for diverse applications, this 32-bit microprocessor empowers your projects with low power consumption and robust performance. Trust in STMicroelectronics' legacy of excellence to enhance your designs and drive efficiency, all while unlocking new possibilities in industrial automation, IoT devices, and beyond. Make every connection count!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of space and simplifies the assembly process, making it ideal for modern compact electronics.

Maximum Supply Voltage: 1.32 V

A low maximum supply voltage enhances power efficiency, making this microprocessor suitable for battery-operated devices.

Package Shape: SQUARE

The square package shape enables a uniform layout, which is useful for optimal thermal performance and compact design in PCB layouts.

Bit Size: 32

Being a 32-bit processor allows for better performance in handling complex computations and larger data sets.

Power Supplies (V): 1.25, 1.8, 2.5/3.3

Support for multiple power supply levels provides flexibility in system design, accommodating various applications and power requirements.

No. of Terminals: 48

A higher number of terminals allows for more functionalities and peripheral connections, enabling complex system designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers excellent heat dissipation and is extremely thin, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.18 V

A low minimum supply voltage contributes to energy efficiency and extended battery life in mobile devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this microprocessor suitable for industrial and harsh environments.

CPU Family: CORTEX-M3

Based on the Cortex-M3 architecture, this microprocessor offers an efficient processing core with a good balance of performance and energy consumption.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliability in extreme conditions, suitable for automotive and outdoor applications.

Terminal Position: QUAD

The quad terminal position allows for better mounting stability and reduces PCB space usage, optimizing the design.

ROM Words: 131072

With 131072 ROM words, this product can store substantial firmware and applications, supporting complex functionalities.

Maximum Seated Height: 1 mm

A very low seated height is advantageous for compact designs, fitting easily into low-profile devices.

Width: 7 mm

The compact width allows for integration in smaller devices, enhancing design flexibility.

Length: 7 mm

Similar to width, a 7 mm length facilitates easy placement in space-constrained environments.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in demanding applications across various environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it is versatile and can handle a range of control and processing tasks effectively.

RAM Bytes: 8192

With 8192 bytes of RAM, the product supports efficient data processing and real-time operations, essential for dynamic applications.

Technology: CMOS

Using CMOS technology offers low power consumption and high speed, making it ideal for energy-sensitive applications.

Terminal Form: NO LEAD

No-lead terminal form reduces environmental impact and provides better solderability, meeting modern lead-free requirements.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA offers a balance between performance and low power consumption, suitable for various applications.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage of 1.25 V is optimized for power efficiency, beneficial for long-lasting battery operation.

ROM Programmability: FLASH

With FLASH ROM programmability, users can easily update firmware and adapt the device for different applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high density in PCB designs, maximizing space efficiency.

Speed: 24 rpm

A processing speed of 24 rpm, combined with its other features, supports efficient data handling and quick responses in applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108CBU62 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108CBU62 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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