Loading...

STM32W108CBU71

STMicroelectronics

STM32W108CBU71 by STMicroelectronics

STM32W108CBU71 by STMicroelectronics is a 32-bit microprocessor featuring a max supply voltage of 1.32V and an industrial temperature range from -40 °C to 105°C. It offers 131072 ROM words and 8192 bytes of RAM, ideal for low-power applications. Its compact design suits various embedded systems requiring efficient processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,642

-

-

-

-

Digiode

USA . 2,639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,639

-

-

-

-

Anansix

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,585 parts In-Stock

1+ parts

$45.087

100+ parts

-

1k+ parts

-

10k+ parts

-

2,585

$45.087

-

-

-

IDEA Electronic Components Group

UK . 1,864 parts In-Stock

1+ parts

$79.418

100+ parts

-

1k+ parts

$71.476

10k+ parts

-

1,864

$79.418

-

$71.476

-

MKK Technologies

India . 1,825 parts In-Stock

1+ parts

$149.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,825

$149.341

-

-

-

DigiPath Technology Company

USA . 1,825 parts In-Stock

1+ parts

$149.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,825

$149.341

-

-

-

Corphita

USA . 4,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,998

-

-

-

-

Parana Technologies

USA . 1,001 parts In-Stock

1+ parts

-

100+ parts

$94.956

1k+ parts

-

10k+ parts

-

1,001

-

$94.956

-

-

Overview

Elevate your designs with the STM32W108CBU71 from STMicroelectronics, a powerhouse of performance and reliability. Engineered for versatility, this 32-bit microprocessor excels in industrial applications, ensuring seamless operation in extreme conditions. With its compact design and low power consumption, it maximizes efficiency while minimizing space requirements. Trust in ST's legacy of innovation and quality to drive your projects to success—experience unmatched value and robust functionality today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount technology allows for compact designs and is ideal for modern circuit board layouts, enabling higher density and improved performance.

Maximum Supply Voltage: 1.32 V

Low maximum supply voltage helps in reducing power consumption, making it suitable for battery-operated and energy-efficient applications.

Package Shape: SQUARE

A square package shape helps in consistent thermal management and improves layout flexibility on PCBs.

Bit Size: 32

Having a 32-bit architecture allows for greater processing power and efficiency, enabling it to handle more complex calculations and data processing tasks.

Power Supplies (V): 2.5/3.3

Compatibility with both 2.5V and 3.3V power supplies makes it versatile for various applications and easy to integrate with different systems.

No. of Terminals: 48

The 48 terminals provide ample connectivity options for various peripherals, enhancing the product’s versatility in different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability help in efficient cooling and make it suitable for space-constrained applications.

Minimum Supply Voltage: 1.18 V

This low minimum supply voltage contributes to enhanced energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature makes it suitable for use in harsh environments and industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 core brings low power consumption and excellent performance, making it perfect for embedded systems requiring real-time processing.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures ensures reliability in outdoor or extreme environments.

Terminal Position: QUAD

Quad terminal positioning supports easy routing and layout design, simplifying PCB design processes.

ROM Words: 131072

A large ROM capacity allows for more complex programs to be stored, enhancing product flexibility and capability for various applications.

Maximum Seated Height: 1 mm

The low seated height allows for even greater density in device design, ideal for compact electronics.

Width: 7 mm

A width of only 7 mm contributes to a small footprint, enabling integration in tight spaces.

Length: 7 mm

Similar to width, the length of 7 mm adds to the compact size of the chip, suitable for portable applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product can endure rigorous working conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Designed as a microprocessor circuit, it enhances the computational capabilities, making it effective for various intelligent applications.

RAM Bytes: 8192

With 8 KB of RAM, the device can handle multiple tasks and operations simultaneously, ensuring efficient program execution.

Technology: CMOS

CMOS technology allows for lower static power consumption and higher density logic, beneficial for modern low-power applications.

Terminal Form: NO LEAD

No-lead terminals provide better thermal performance and are compatible with lead-free soldering processes, supporting environmental regulations.

Maximum Supply Current: 150 mA

With a maximum supply current of 150 mA, it can deliver good performance while helping to keep overall power consumption low.

Nominal Supply Voltage: 1.25 V

Operating at a nominal supply voltage of 1.25 V ensures optimal performance while minimizing energy consumption.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and flexibility in application development, making it suitable for changing application needs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a compact configuration, which is essential for high-density PCB designs.

Speed: 24 rpm

A speed rating of 24 rpm indicates the capability for moderately fast operations, suitable for real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108CBU71 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108CBU71 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19