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STM32W108CBU64

STMicroelectronics

STM32W108CBU64 by STMicroelectronics

STM32W108CBU64 by STMicroelectronics is a 32-bit microprocessor featuring a max supply voltage of 1.32V and an industrial temperature range from -40 °C to 85°C. With 131072 ROM words and 8192 bytes of RAM, it's ideal for low-power applications. Its compact design suits various embedded systems requiring efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,096 parts In-Stock

1+ parts

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3,096

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Digiode

USA . 2,844 parts In-Stock

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2,844

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Anansix

USA . 1,837 parts In-Stock

1+ parts

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1,837

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,492 parts In-Stock

1+ parts

$66.317

100+ parts

-

1k+ parts

$59.686

10k+ parts

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1,492

$66.317

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$59.686

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Corohmni

South Africa . 2,102 parts In-Stock

1+ parts

$79.169

100+ parts

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2,102

$79.169

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MKK Technologies

India . 1,467 parts In-Stock

1+ parts

$124.705

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1,467

$124.705

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DigiPath Technology Company

USA . 1,467 parts In-Stock

1+ parts

$124.705

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1,467

$124.705

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Corphita

USA . 3,614 parts In-Stock

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3,614

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Parana Technologies

USA . 98 parts In-Stock

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$79.292

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98

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$79.292

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Overview

Unlock limitless possibilities with the STM32W108CBU64 from STMicroelectronics, a leader in quality and innovation. This advanced microprocessor combines energy efficiency and robust performance, perfect for industrial applications and IoT devices. With its compact design and superior temperature resilience, it offers unmatched value, enhancing product longevity and reliability. Elevate your projects with a trusted solution that seamlessly integrates power and precision!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic systems, saving space and improving performance.

Maximum Supply Voltage: 1.32 V

Lower supply voltage reduces power consumption, making this product ideal for battery-operated devices.

Package Shape: SQUARE

The square shape facilitates efficient use of board space and enhances thermal management.

Bit Size: 32

With a 32-bit architecture, this microprocessor can handle more data at once, improving processing speed and overall performance.

Power Supplies (V): 1.25, 1.8, 2.5/3.3

Flexible power supply options allow for compatibility with a wide range of systems and reduce design complexity.

No. of Terminals: 48

The 48 terminals provide ample connections for various peripherals, enhancing the microprocessor's functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation, crucial for maintaining performance and longevity in demanding applications.

Minimum Supply Voltage: 1.18 V

The low minimum supply voltage further optimizes power efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microprocessor suitable for industrial environments and applications.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU offers excellent performance for embedded applications, supporting a wide range of software solutions.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures ensures reliability in harsh conditions, making this product ideal for industrial and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and protects against corrosion, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout designs and improved electrical performance by reducing signal integrity issues.

ROM Words: 131072

The large ROM capacity supports complex applications and extensive firmware, enhancing the device's versatility.

Maximum Seated Height: 1 mm

The low profile helps in space-constrained designs and improves performance by minimizing parasitic effects.

Width: 7 mm

The compact width enables the use of this microprocessor in dense circuit layouts, suitable for modern electronic devices.

Maximum Time At Peak Reflow Temperature (s): 40

A long reflow time allows for a durable solder bond, ensuring reliability in assembly processes.

Peak Reflow Temperature °C: 260

High reflow temperatures ensure optimal soldering quality, critical for maintaining performance in electronic assemblies.

Length: 7 mm

The small length complements the compact design needs of modern electronics, making it easier to integrate into smaller systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in demanding environments and applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it powers a wide range of applications, from consumer electronics to industrial controls.

RAM Bytes: 8192

Generous RAM size allows for efficient data processing and management, supporting complex applications.

Technology: CMOS

CMOS technology delivers lower power consumption and higher speed, making it ideal for portable devices.

Terminal Form: NO LEAD

No lead design reduces environmental impact and allows for more flexible PCB designs.

Maximum Supply Current: 150 mA

The moderate supply current balance performance with energy efficiency, extending battery life in portable devices.

Nominal Supply Voltage: 1.25 V

A nominal supply voltage of 1.25 V simplifies power regulation and optimizes energy consumption.

ROM Programmability: FLASH

Flash ROM programmability offers the flexibility to update firmware and enhance device functionality over time.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for high-density designs, optimizing space utilization on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating helps in managing the handling and reflow soldering processes effectively, ensuring product reliability.

Speed: 24 rpm

A speed of 24 rpm indicates the capability to process data efficiently, valuable for real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STM32W108CBU64 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32W108CBU64 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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