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SB3229-E1-T

Onsemi

SB3229-E1-T by Onsemi

SB3229-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating from 0 to 40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in rectangular package style is ideal for various uPs and uCs functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,863 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 242 parts In-Stock

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$20.880

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SupplyDigital Components

Austria . 6,842 parts In-Stock

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TANS Electronics

Latvia . 3,415 parts In-Stock

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Vigor

Singapore . 2,469 parts In-Stock

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Problanco Electronics

Mexico . 1,321 parts In-Stock

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Microchip USA

USA . 1,319 parts In-Stock

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Corphita

USA . 1,227 parts In-Stock

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Corohmni

South Africa . 346 parts In-Stock

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Kulean Microsystems

USA . 318 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 275 parts In-Stock

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Overview

Upgrade your electronics with the SB3229-E1-T by Onsemi, a top-tier manufacturer known for quality and reliability. This versatile peripheral IC is perfect for a wide range of applications, offering seamless integration and high performance. With its innovative technology and sleek design, this product provides unmatched value and benefits to customers looking for superior functionality and efficiency. Trust Onsemi to deliver cutting-edge solutions for all your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a PCB, saving time and cost during manufacturing.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy integration into various electronic devices.

No. of Terminals: 25

Sufficient number of terminals for connecting to other components and peripherals in a system.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly provides a compact and space-saving design for applications with size constraints.

Maximum Operating Temperature: 40 °C

High maximum operating temperature tolerance ensures reliability in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for usage in a wide range of temperature environments.

Maximum Seated Height: 1.525 mm

Low seated height enables a slim profile for the overall device design.

Width: 3.81 mm

Narrow width allows for compact placement on a PCB, saving space in the system layout.

Length: 5.59 mm

Moderate length provides a balanced form factor for easy integration without compromising on space.

Temperature Grade: COMMERCIAL

Commercial grade temperature handling is suitable for standard operating environments, making it cost-effective.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit functionality allows for advanced computational capabilities in the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly process and enhances reliability through improved soldering connections.

Nominal Supply Voltage: 1.25 V

Low nominal supply voltage contributes to energy efficiency and extended battery life in portable devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SB3229-E1-T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N25

Length:

5.59 mm

No. of Terminals:

25

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.525 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.81 mm

Peripheral IC Type:

Trade Compliance

SB3229-E1-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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