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SB3231-E1

Onsemi

SB3231-E1 by Onsemi

SB3231-E1 by Onsemi is a CMOS microprocessor circuit with 25 terminals. It operates b/w 0-40 °C, ideal for commercial applications. This rectangular surface-mount IC has a nominal voltage of 1.25V, suitable for various microelectronic assemblies.

Median Price

$96.150

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 16 parts In-Stock

1+ parts

$96.150

100+ parts

$72.120

1k+ parts

$62.500

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16

$96.150

$72.120

$62.500

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Vyrian

USA . 2,919 parts In-Stock

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2,919

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Digiode

USA . 2,337 parts In-Stock

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2,337

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Distributors (Availability)

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AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$17.760

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537

$17.760

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Corohmni

South Africa . 435 parts In-Stock

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$96.150

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435

$96.150

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Kulean Microsystems

USA . 7,710 parts In-Stock

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7,710

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Problanco Electronics

Mexico . 6,270 parts In-Stock

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6,270

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SupplyDigital Components

Austria . 5,931 parts In-Stock

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5,931

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TANS Electronics

Latvia . 4,869 parts In-Stock

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4,869

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UHIMA Technologies

Türkiye . 376 parts In-Stock

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376

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Corphita

USA . 327 parts In-Stock

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327

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Microchip USA

USA . 259 parts In-Stock

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259

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Overview

Enhance your electronic devices with the SB3231-E1 by Onsemi, a top-quality peripheral IC that offers unparalleled performance and reliability. Onsemi's reputation for excellence ensures that this product meets the highest standards in the industry. Ideal for a wide range of applications, this microprocessor circuit provides value and benefits to customers looking for cutting-edge technology. Upgrade your devices with the SB3231-E1 and experience the advantages of superior quality and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and quick assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient use of space on the PCB, maximizing component density.

No. of Terminals: 25

Having 25 terminals provides ample connectivity options for various inputs and outputs, making this product versatile for different applications.

Maximum Operating Temperature: 40 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliability in extreme heat.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows for reliable performance in cold environments, increasing the product's versatility.

Maximum Seated Height: 1.525 mm

The low maximum seated height helps in compact design of the overall electronic system, allowing for slim and sleek product designs.

Width: 3.81 mm

The narrow width of the package enables efficient space utilization on the PCB, contributing to a more compact and streamlined electronic system.

Length: 5.59 mm

The compact length of the package further aids in space-saving on the PCB, allowing for more components to be accommodated in a limited area.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges, making this product suitable for a wide range of commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC enhances the functionality and processing capabilities of the product, making it suitable for advanced applications requiring computational power.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable operation of the product.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process during assembly, improving manufacturing efficiency and ensuring reliable connections.

Nominal Supply Voltage: 1.25 V

Having a lower nominal supply voltage of 1.25 V helps in reducing power consumption and heat generation, making the product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SB3231-E1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N25

Length:

5.59 mm

No. of Terminals:

25

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.525 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.81 mm

Peripheral IC Type:

Trade Compliance

SB3231-E1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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