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R3910-CFAB-E1T

Onsemi

R3910-CFAB-E1T by Onsemi

R3910-CFAB-E1T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40°C. It has a supply voltage of 1.25V and can withstand peak reflow temperature of 260°C for up to 30 seconds. Ideal for commercial applications requiring compact surface-mount peripheral ICs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,258 parts In-Stock

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Digiode

USA . 844 parts In-Stock

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Nova Conductors

Japan . 54 parts In-Stock

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Semicontronic

India . 1,476 parts In-Stock

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$4.000

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$3.900

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$3.880

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AZTECH Wire

Italy . 318 parts In-Stock

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$5.803

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Aztec Data Supply Inc.

USA . 2,784 parts In-Stock

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$19.025

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$19.025

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Ampacity Inc.

Singapore . 588 parts In-Stock

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$30.000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,914 parts In-Stock

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SupplyDigital Components

Austria . 8,226 parts In-Stock

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Kulean Microsystems

USA . 5,739 parts In-Stock

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TANS Electronics

Latvia . 5,274 parts In-Stock

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Problanco Electronics

Mexico . 2,774 parts In-Stock

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Argo Parts USA

USA . 2,362 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,993 parts In-Stock

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UHIMA Technologies

Türkiye . 726 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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Continental Prestige Electronics

USA . 464 parts In-Stock

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Microchip USA

USA . 157 parts In-Stock

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Overview

Enhance your electronic devices with the reliable R3910-CFAB-E1T by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it ideal for a wide range of applications. Customers can expect outstanding value and benefits from this innovative component, enhancing performance and efficiency. Trust Onsemi to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Provides a compact and versatile design for various applications.

No. of Terminals: 25

Offers a sufficient number of connections for versatile functionality and compatibility.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Ensures high quality and reliability in electronic assemblies.

Maximum Operating Temperature: 40 °C

Enables operation in a wide range of environments without risk of overheating.

Minimum Operating Temperature: 0 °C

Allows for reliable performance even in colder temperatures.

Maximum Seated Height: 1.525 mm

Provides a low profile design for space-constrained applications.

Width: 3.81 mm

Offers a compact footprint for efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and bonding during assembly processes.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow processes for secure solder joints.

Length: 5.59 mm

Provides a balanced and practical size for various electronic devices.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications with consistent performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Offers advanced processing capabilities for complex functions.

Technology: CMOS

Utilizes low power consumption and high integration for efficient operation.

Terminal Form: NO LEAD

Ensures reliable connections without the risk of lead contamination.

Nominal Supply Voltage: 1.25 V

Supports a low voltage operation for power-efficient applications.

Moisture Sensitivity Level (MSL): 3

Provides protection against moisture damage for enhanced durability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs R3910-CFAB-E1T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N25

Length:

5.59 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

25

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.525 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.81 mm

Peripheral IC Type:

Trade Compliance

R3910-CFAB-E1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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