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E7111-0-102A19-AG

Onsemi

E7111-0-102A19-AG by Onsemi

E7111-0-102A19-AG by Onsemi is a consumer IC with 19 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, with a supply voltage range of 1.05V to 2V. This industrial-grade IC is suitable for various consumer circuit applications requiring compact dimensions and surface-mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,234 parts In-Stock

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Digiode

USA . 2,082 parts In-Stock

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2,082

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$1.647

100+ parts

$1.499

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$1.351

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750

$1.647

$1.499

$1.351

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Corohmni

South Africa . 467 parts In-Stock

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$1.925

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467

$1.925

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Aztec Data Supply Inc.

USA . 31,485 parts In-Stock

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$2.656

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$2.656

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AZTECH Wire

Italy . 576 parts In-Stock

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$9.903

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576

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Ampacity Inc.

Singapore . 254 parts In-Stock

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$15.800

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254

$15.800

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QUARKTWIN TECHNOLOGY LTD

USA . 14,697 parts In-Stock

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SupplyDigital Components

Austria . 7,896 parts In-Stock

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Kulean Microsystems

USA . 6,447 parts In-Stock

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Microchip USA

USA . 4,134 parts In-Stock

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Continental Prestige Electronics

USA . 3,064 parts In-Stock

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Corphita

USA . 2,445 parts In-Stock

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Problanco Electronics

Mexico . 2,111 parts In-Stock

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TANS Electronics

Latvia . 1,762 parts In-Stock

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Argo Parts USA

USA . 1,241 parts In-Stock

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UHIMA Technologies

Türkiye . 527 parts In-Stock

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527

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the cutting-edge E7111-0-102A19-AG by Onsemi, a top-tier manufacturer known for its exceptional quality in the Consumer ICs category. This innovative product offers unmatched value with its versatile applications and superior performance. Experience the benefits of reliability, efficiency, and precision in every use, setting it apart from the competition. Elevate your projects with the E7111-0-102A19-AG and unlock endless possibilities in consumer electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier assembly and more efficient use of PCB space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes this product suitable for a variety of applications.

Terminal Position: BOTTOM

The bottom terminal position allows for easy connections and reduces the risk of signal interference.

Width: 2.9 mm

The compact width of the product enables efficient use of board space and allows for more components to be packed into a smaller area.

Minimum Supply Voltage (Vsup): 1.05 V

The low minimum supply voltage allows for energy-efficient operation and compatibility with a range of power sources.

Terminal Form: BALL

The ball terminal form provides a reliable connection and helps in achieving high-quality electrical performance.

Technical Specifications

Other Function Consumer ICs E7111-0-102A19-AG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B19

Length:

5.25 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

LGA19,3X8,25/34

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.525 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.05 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.625 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.9 mm

Trade Compliance

E7111-0-102A19-AG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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