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PCM2903EG4

Texas Instruments

PCM2903EG4 by Texas Instruments

PCM2903EG4 by Texas Instruments is a consumer IC with 28 terminals, operating at 3.3V. It has a small outline package and can withstand temperatures from -25 to 85°C. Ideal for applications requiring low power consumption and compact design in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,963 parts In-Stock

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3,963

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Vyrian

USA . 2,784 parts In-Stock

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2,784

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,797 parts In-Stock

1+ parts

$1.517

100+ parts

-

1k+ parts

$2.178

10k+ parts

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1,797

$1.517

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$2.178

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DigiPath Technology Company

USA . 729 parts In-Stock

1+ parts

$1.671

100+ parts

$1.537

1k+ parts

-

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729

$1.671

$1.537

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ChromeModa Solutions

Germany . 1,000 parts In-Stock

1+ parts

$1.705

100+ parts

$1.398

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1,000

$1.705

$1.398

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IDEA Electronic Components Group

UK . 85 parts In-Stock

1+ parts

$1.705

100+ parts

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$1.534

10k+ parts

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85

$1.705

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$1.534

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Ampacity Inc.

Singapore . 624 parts In-Stock

1+ parts

$3.800

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624

$3.800

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AZTECH Wire

Italy . 258 parts In-Stock

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$13.689

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258

$13.689

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One Stop Electronics

USA . 982 parts In-Stock

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$16.800

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982

$16.800

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Corphita

USA . 4,564 parts In-Stock

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4,564

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Continental Prestige Electronics

USA . 3,238 parts In-Stock

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3,238

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Argo Parts USA

USA . 2,829 parts In-Stock

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2,829

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Bastille Electronics

Australia . 97 parts In-Stock

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Overview

Unlock the power of audio innovation with the PCM2903EG4 by Texas Instruments. This cutting-edge consumer IC offers unparalleled quality and reliability, thanks to its industry-leading manufacturer. Ideal for a wide range of applications, this versatile product delivers exceptional value and benefits to customers seeking top-notch performance. Explore endless possibilities with the PCM2903EG4 and experience the advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more efficient.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, ensuring compatibility and optimal performance.

Power Supplies (V): 3.3

A power supply of 3.3V provides efficient and stable power to the IC.

No. of Terminals: 28

With 28 terminals, this IC offers multiple connection options for increased functionality.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space and allows for compact designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can perform reliably even under high temperatures.

Minimum Operating Temperature: -25 °C

The minimum operating temperature of -25°C ensures functionality in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit board layout and connection options.

Maximum Seated Height: 2 mm

The low maximum seated height allows for a slim profile and compact design.

Width: 5.3 mm

With a width of 5.3mm, this IC is suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this IC can withstand reflow soldering processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability.

Length: 10.2 mm

The length of 10.2mm allows for easy integration into various circuit designs.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade makes this IC suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering.

Maximum Supply Current: 70 mA

With a maximum supply current of 70mA, this IC can operate efficiently without drawing excessive power.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm allows for dense packing and space-saving designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with different power sources.

Technical Specifications

Other Function Consumer ICs PCM2903EG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

PCM2903EG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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