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PCM2904DBRG4

Texas Instruments

PCM2904DBRG4 by Texas Instruments

PCM2904DBRG4 by Texas Instruments is a consumer IC with 28 terminals, operating at 5V. It has a small outline package style and can handle temperatures from -25 to 85°C. Ideal for applications requiring high-quality audio processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,549 parts In-Stock

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6,549

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Digiode

USA . 3,194 parts In-Stock

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3,194

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 861 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

$3.328

10k+ parts

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861

$2.840

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$3.328

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DigiPath Technology Company

USA . 515 parts In-Stock

1+ parts

$3.127

100+ parts

$2.877

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-

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515

$3.127

$2.877

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ChromeModa Solutions

Germany . 3,246 parts In-Stock

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$3.191

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$2.617

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3,246

$3.191

$2.617

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IDEA Electronic Components Group

UK . 2,195 parts In-Stock

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$3.191

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$2.872

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2,195

$3.191

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$2.872

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Corohmni

South Africa . 885 parts In-Stock

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$3.759

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885

$3.759

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One Stop Electronics

USA . 155 parts In-Stock

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$6.800

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155

$6.800

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Semicontronic

India . 679 parts In-Stock

1+ parts

$8.800

100+ parts

$8.580

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$8.536

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679

$8.800

$8.580

$8.536

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Ampacity Inc.

Singapore . 966 parts In-Stock

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$13.800

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966

$13.800

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AZTECH Wire

Italy . 355 parts In-Stock

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$15.782

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355

$15.782

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Argo Parts USA

USA . 2,514 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 687 parts In-Stock

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Corphita

USA . 526 parts In-Stock

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526

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Overview

Unlock the power of audio with the PCM2904DBRG4 from Texas Instruments. This high-quality consumer IC offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With a compact design and advanced features, this product delivers exceptional value and benefits to customers looking for superior sound quality and functionality. Trust Texas Instruments for innovative solutions that enhance your audio experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits, ensuring a longer lifespan for the product.

Surface Mount: YES

Ease of installation and PCB layout flexibility with surface mount technology.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronic applications, catering to a wide range of consumer needs.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a variety of environmental conditions without overheating.

Minimum Operating Temperature: -25 °C

Capable of functioning in colder temperatures, making it suitable for various applications.

Maximum Seated Height: 2 mm

Compact design allows for easier integration into space-constrained electronic devices.

Minimum Supply Voltage (Vsup): 4.35 V

Operates efficiently with low power supply voltage, saving energy.

Maximum Supply Current: 67 mA

Low power consumption, making it an energy-efficient choice for consumer electronic devices.

Technical Specifications

Other Function Consumer ICs PCM2904DBRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.25V TO 3.5V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

67 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

PCM2904DBRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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