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FSA880UMX

Onsemi

FSA880UMX by Onsemi

FSA880UMX by Onsemi is a 16-terminal consumer IC with a package style of chip carrier. It operates in industrial temperature range from -40 to 85°C, suitable for various consumer circuit applications. With a very thin profile and surface mount capability, it offers flexibility in design and integration.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 360,967 parts In-Stock

1+ parts

-

100+ parts

$0.411

1k+ parts

$0.341

10k+ parts

$0.304

360,967

-

$0.411

$0.341

$0.304

Verical

USA . 331,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.426

10k+ parts

$0.380

331,872

-

-

$0.426

$0.380

DigiKey

USA . 315,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.370

10k+ parts

-

315,373

-

-

$0.370

-

Farnell

UK . 5,594 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.267

5,594

-

-

-

$0.267

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 562 parts In-Stock

1+ parts

$0.335

100+ parts

-

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562

$0.335

-

-

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DigiKey Marketplace

USA . 315,373 parts In-Stock

1+ parts

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-

1k+ parts

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315,373

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-

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Vyrian

USA . 171,083 parts In-Stock

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171,083

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 233,300 parts In-Stock

1+ parts

$0.227

100+ parts

$0.221

1k+ parts

$0.220

10k+ parts

-

233,300

$0.227

$0.221

$0.220

-

Ampacity Inc.

Singapore . 170,825 parts In-Stock

1+ parts

$0.227

100+ parts

-

1k+ parts

-

10k+ parts

-

170,825

$0.227

-

-

-

Corohmni

South Africa . 456 parts In-Stock

1+ parts

$0.267

100+ parts

-

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456

$0.267

-

-

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Corphita

USA . 2,499 parts In-Stock

1+ parts

$0.318

100+ parts

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2,499

$0.318

-

-

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Aztec Data Supply Inc.

USA . 4,595 parts In-Stock

1+ parts

$0.823

100+ parts

-

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-

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4,595

$0.823

-

-

-

Authorized Procurement Solutions

USA . 120,000 parts In-Stock

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120,000

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Continental Prestige Electronics

USA . 46,222 parts In-Stock

1+ parts

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100+ parts

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$0.255

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46,222

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-

$0.255

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Kepictronics

USA . 30,000 parts In-Stock

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30,000

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Perfect Parts

USA . 14,239 parts In-Stock

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14,239

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SupplyDigital Components

Austria . 7,848 parts In-Stock

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7,848

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Kulean Microsystems

USA . 4,306 parts In-Stock

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4,306

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Argo Parts USA

USA . 2,885 parts In-Stock

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2,885

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Microchip USA

USA . 2,566 parts In-Stock

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2,566

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TANS Electronics

Latvia . 1,789 parts In-Stock

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1,789

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Infinite Electronics LLP (Excess)

. 1,007 parts In-Stock

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1,007

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Supply Digital

USA . 710 parts In-Stock

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710

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UHIMA Technologies

Türkiye . 506 parts In-Stock

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506

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Problanco Electronics

Mexico . 249 parts In-Stock

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249

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Discover the FSA880UMX by Onsemi, a top-quality consumer IC that promises reliability and performance. With Onsemi's reputation for excellence in manufacturing, this chip carrier boasts a very thin profile and 16 terminals for versatile applications. Ideal for industrial use, this rectangular package offers a wide operating temperature range from -40°C to 85°C. From consumer electronics to automotive systems, the FSA880UMX provides high value and reliability for all your circuit needs. Upgrade your designs with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is lightweight and durable, making the product resistant to damage during handling and transportation.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily integrated into existing circuit designs.

No. of Terminals: 16

With 16 terminals, this product can accommodate a wide range of connection points for different circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Width: 1.8 mm

Narrow width allows for compact and space-saving circuit designs, ideal for applications with limited space.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement enables energy-efficient operation in various power supply configurations.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures product durability during component soldering and rework processes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and complies with RoHS regulations for hazardous substance restrictions.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting on circuit boards, enabling compact and efficient circuit layouts.

Maximum Supply Voltage (Vsup): 4.4 V

High maximum supply voltage tolerance provides flexibility for varying power supply voltage levels in different operating conditions.

Technical Specifications

Other Function Consumer ICs FSA880UMX attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.4 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.8 mm

Trade Compliance

FSA880UMX General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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