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FSA881UMX

Onsemi

FSA881UMX by Onsemi

FSA881UMX by Onsemi is a consumer circuit IC with 16 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a very thin profile of 0.55mm and surface mount capability, it offers high performance in compact designs.

Median Price

$0.521

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,995 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

16,995

-

$0.502

$0.417

$0.371

DigiKey

USA . 16,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

-

16,995

-

-

$0.630

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

10,000

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,681 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

-

10k+ parts

-

2,681

$0.391

-

-

-

Bristol Electronics

USA . 4,934 parts In-Stock

1+ parts

$1.050

100+ parts

$0.389

1k+ parts

$0.273

10k+ parts

-

4,934

$1.050

$0.389

$0.273

-

Chip Stock

USA . 66,000 parts In-Stock

1+ parts

-

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1k+ parts

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66,000

-

-

-

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DigiKey Marketplace

USA . 16,995 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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16,995

-

-

-

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Vyrian

USA . 16,836 parts In-Stock

1+ parts

-

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1k+ parts

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16,836

-

-

-

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Dan-Mar Components

USA . 4,934 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,934

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 14,300 parts In-Stock

1+ parts

$0.350

100+ parts

$0.341

1k+ parts

$0.340

10k+ parts

-

14,300

$0.350

$0.341

$0.340

-

Corphita

USA . 949 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

10k+ parts

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949

$0.371

-

-

-

Corohmni

South Africa . 407 parts In-Stock

1+ parts

$0.412

100+ parts

-

1k+ parts

-

10k+ parts

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407

$0.412

-

-

-

Component Stockers USA

USA . 23,193 parts In-Stock

1+ parts

$0.430

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

$0.360

23,193

$0.430

$0.400

$0.360

$0.360

Ampacity Inc.

Singapore . 16,969 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

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16,969

$0.760

-

-

-

Aztec Data Supply Inc.

USA . 2,119 parts In-Stock

1+ parts

$1.471

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$1.471

-

-

-

Perfect Parts

USA . 16,800 parts In-Stock

1+ parts

-

100+ parts

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16,800

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-

-

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SupplyDigital Components

Austria . 4,599 parts In-Stock

1+ parts

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4,599

-

-

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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4,500

-

-

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Microchip USA

USA . 3,527 parts In-Stock

1+ parts

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3,527

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-

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Kulean Microsystems

USA . 2,830 parts In-Stock

1+ parts

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2,830

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Supply Digital

USA . 2,064 parts In-Stock

1+ parts

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2,064

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TANS Electronics

Latvia . 2,011 parts In-Stock

1+ parts

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2,011

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-

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Argo Parts USA

USA . 396 parts In-Stock

1+ parts

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396

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Continental Prestige Electronics

USA . 294 parts In-Stock

1+ parts

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294

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UHIMA Technologies

Türkiye . 261 parts In-Stock

1+ parts

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261

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Bastille Electronics

Australia . 47 parts In-Stock

1+ parts

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47

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Problanco Electronics

Mexico . 14 parts In-Stock

1+ parts

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14

-

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-

-

Overview

Discover the innovative FSA881UMX by Onsemi, a cutting-edge consumer circuit that sets the standard for quality and reliability. With a sleek rectangular shape and surface-mount design, this chip carrier offers unparalleled performance in a compact package. Whether used in industrial applications or everyday devices, this IC delivers exceptional value and efficiency. Trust Onsemi's expertise in semiconductor manufacturing to provide you with a product that exceeds expectations. Upgrade your technology with the FSA881UMX and experience the benefits of superior engineering and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the IC, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts and facilitates seamless integration within electronic devices.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities, making the IC versatile for different consumer circuit applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of the IC even under demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature indicates the IC can perform effectively in a wide range of temperature settings, suitable for various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity, corrosion resistance, and solderability, enhancing the performance and reliability of the IC.

Width: 1.8 mm

Compact width dimension allows for efficient space utilization on PCBs, enabling the integration of the IC in size-constrained consumer devices.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement makes the IC energy-efficient and suitable for applications where power consumption is a concern.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering during assembly process, leading to reliable and robust connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for efficient soldering of the IC onto PCBs, ensuring strong and durable connections.

Length: 2.6 mm

Compact length dimension contributes to space-saving design and integration flexibility within consumer electronic applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates the IC can withstand harsh operating conditions, making it suitable for industrial and commercial applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting on PCBs, allowing for multiple connections within a limited space.

Maximum Supply Voltage (Vsup): 4.4 V

High maximum supply voltage capacity provides flexibility in power input options, accommodating a wide range of voltage requirements for different applications.

Technical Specifications

Other Function Consumer ICs FSA881UMX attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.4 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.8 mm

Trade Compliance

FSA881UMX General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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