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VSP1900DBTG4

Texas Instruments

VSP1900DBTG4 by Texas Instruments

VSP1900DBTG4 by Texas Instruments is a consumer IC with 30 terminals in a small outline, thin profile package. It operates b/w 0-85°C, with supply voltage ranging from 2.7-5.5V. Ideal for applications requiring compact design and high performance in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,982 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,982

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-

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Digiode

USA . 3,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,400

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Chip Stock

USA . 940 parts In-Stock

1+ parts

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940

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,736 parts In-Stock

1+ parts

$3.090

100+ parts

-

1k+ parts

$3.608

10k+ parts

-

1,736

$3.090

-

$3.608

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ChromeModa Solutions

Germany . 1,054 parts In-Stock

1+ parts

$3.472

100+ parts

$2.847

1k+ parts

-

10k+ parts

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1,054

$3.472

$2.847

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IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$3.472

100+ parts

-

1k+ parts

$3.125

10k+ parts

-

179

$3.472

-

$3.125

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One Stop Electronics

USA . 292 parts In-Stock

1+ parts

$7.800

100+ parts

-

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10k+ parts

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292

$7.800

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-

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AZTECH Wire

Italy . 636 parts In-Stock

1+ parts

$9.071

100+ parts

-

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636

$9.071

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Semicontronic

India . 873 parts In-Stock

1+ parts

$12.800

100+ parts

$12.480

1k+ parts

$12.416

10k+ parts

-

873

$12.800

$12.480

$12.416

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Ampacity Inc.

Singapore . 791 parts In-Stock

1+ parts

$13.800

100+ parts

-

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791

$13.800

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Continental Prestige Electronics

USA . 6,932 parts In-Stock

1+ parts

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6,932

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Argo Parts USA

USA . 3,861 parts In-Stock

1+ parts

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100+ parts

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3,861

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Corphita

USA . 3,230 parts In-Stock

1+ parts

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3,230

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DigiPath Technology Company

USA . 1,892 parts In-Stock

1+ parts

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100+ parts

$3.130

1k+ parts

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10k+ parts

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1,892

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$3.130

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Microchip USA

USA . 1,618 parts In-Stock

1+ parts

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100+ parts

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1,618

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Bastille Electronics

Australia . 35 parts In-Stock

1+ parts

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35

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Overview

Enhance your electronic devices with the VSP1900DBTG4 by Texas Instruments, a high-quality consumer IC that offers unmatched performance and reliability. Texas Instruments is known for its cutting-edge technology and innovative solutions in the semiconductor industry, making this product a top choice for a wide range of applications. With its small outline and dual terminal position, this IC provides flexibility and efficiency in design. Experience the value and benefits this product brings to your projects, from improved functionality to increased durability. Upgrade your electronic designs with the VSP1900DBTG4 and unleash the full potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good strength and durability to the package, ensuring long-term reliability of the IC.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation of the IC on circuit boards, saving space and reducing assembly time.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics applications, this IC is optimized for performance and efficiency in devices used by end-users.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can withstand elevated temperatures without compromising its functionality, making it suitable for a wide range of operating conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the IC to operate effectively even in colder environments, increasing its versatility and adaptability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold as terminal finishes ensures good conductivity, corrosion resistance, and solderability, enhancing the overall performance and reliability of the IC.

Width: 4.4 mm

The compact width of the IC makes it suitable for applications where space is limited, allowing for efficient integration into small electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement allows the IC to operate even in low-power scenarios, making it energy-efficient and suitable for battery-powered devices.

Terminal Pitch: 0.5 mm

The small terminal pitch facilitates high-density mounting of the IC on circuit boards, enabling more functionality in a limited space.

Moisture Sensitivity Level (MSL): 2

The moderate moisture sensitivity level indicates that the IC can withstand some exposure to moisture during assembly and operation, ensuring reliability in various environmental conditions.

Technical Specifications

Other Function Consumer ICs VSP1900DBTG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES -9V TO 15.5V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

VSP1900DBTG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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