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VSP1900DBTRG4

Texas Instruments

VSP1900DBTRG4 by Texas Instruments

VSP1900DBTRG4 by Texas Instruments is a small outline consumer IC with 30 terminals. It operates b/w -25°C to 85°C, suitable for various applications. With a supply voltage range of 2.7V to 5.5V, it is ideal for compact electronic devices requiring precise circuit control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,124 parts In-Stock

1+ parts

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4,124

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Digiode

USA . 3,815 parts In-Stock

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3,815

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,067 parts In-Stock

1+ parts

$2.057

100+ parts

-

1k+ parts

$2.578

10k+ parts

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1,067

$2.057

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$2.578

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DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$2.265

100+ parts

$2.084

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-

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1,888

$2.265

$2.084

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IDEA Electronic Components Group

UK . 1,905 parts In-Stock

1+ parts

$2.311

100+ parts

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$2.080

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1,905

$2.311

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$2.080

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ChromeModa Solutions

Germany . 197 parts In-Stock

1+ parts

$2.311

100+ parts

$1.895

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197

$2.311

$1.895

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AZTECH Wire

Italy . 568 parts In-Stock

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$6.000

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568

$6.000

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Semicontronic

India . 451 parts In-Stock

1+ parts

$12.800

100+ parts

$12.480

1k+ parts

$12.416

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451

$12.800

$12.480

$12.416

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One Stop Electronics

USA . 678 parts In-Stock

1+ parts

$17.800

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678

$17.800

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Ampacity Inc.

Singapore . 151 parts In-Stock

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$19.800

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151

$19.800

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Continental Prestige Electronics

USA . 5,275 parts In-Stock

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5,275

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Argo Parts USA

USA . 2,994 parts In-Stock

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Corphita

USA . 1,267 parts In-Stock

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Microchip USA

USA . 155 parts In-Stock

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155

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the cutting-edge VSP1900DBTRG4 by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This innovative consumer IC offers unparalleled performance in a compact package, making it ideal for a wide range of applications. With its advanced features and efficient design, this product provides unmatched value, benefits, and advantages to customers looking for high-quality solutions. Upgrade your projects with the VSP1900DBTRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape offers versatility in placement and integration within different electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding operating conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The wide range of operating temperatures ensures reliable functionality in both extreme cold and hot environments.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement allows for flexibility in power supply design and energy efficiency.

Technical Specifications

Other Function Consumer ICs VSP1900DBTRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES -9V TO 15.5V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G30

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

VSP1900DBTRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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