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TLV990-28PFB

Texas Instruments

TLV990-28PFB by Texas Instruments

TLV990-28PFB by Texas Instruments is a 48-terminal consumer IC with CMOS technology. It operates b/w -20 to 75°C, suitable for commercial extended temperature applications. With a terminal pitch of 0.5mm and nickel palladium gold finish, it is ideal for surface mount assembly in various electronic devices.

Median Price

$12.836

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,728 parts In-Stock

1+ parts

$10.589

100+ parts

$8.633

1k+ parts

$5.755

10k+ parts

-

6,728

$10.589

$8.633

$5.755

-

Rochester

USA . 2,596 parts In-Stock

1+ parts

-

100+ parts

$11.410

1k+ parts

$10.210

10k+ parts

$9.610

2,596

-

$11.410

$10.210

$9.610

DigiKey

USA . 2,596 parts In-Stock

1+ parts

-

100+ parts

$15.010

1k+ parts

-

10k+ parts

-

2,596

-

$15.010

-

-

Verical

USA . 2,346 parts In-Stock

1+ parts

-

100+ parts

$14.262

1k+ parts

$12.762

10k+ parts

$12.012

2,346

-

$14.262

$12.762

$12.012

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 236 parts In-Stock

1+ parts

$7.590

100+ parts

-

1k+ parts

-

10k+ parts

-

236

$7.590

-

-

-

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$7.920

100+ parts

-

1k+ parts

-

10k+ parts

-

48

$7.920

-

-

-

Vyrian

USA . 3,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,371

-

-

-

-

Bristol Electronics

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 276 parts In-Stock

1+ parts

$0.326

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$0.326

-

-

-

Parana Technologies

USA . 993 parts In-Stock

1+ parts

$0.397

100+ parts

-

1k+ parts

$1.585

10k+ parts

-

993

$0.397

-

$1.585

-

DigiPath Technology Company

USA . 1,697 parts In-Stock

1+ parts

$0.437

100+ parts

$0.402

1k+ parts

-

10k+ parts

-

1,697

$0.437

$0.402

-

-

IDEA Electronic Components Group

UK . 1,168 parts In-Stock

1+ parts

$0.446

100+ parts

-

1k+ parts

$0.401

10k+ parts

-

1,168

$0.446

-

$0.401

-

ChromeModa Solutions

Germany . 886 parts In-Stock

1+ parts

$0.446

100+ parts

$0.366

1k+ parts

-

10k+ parts

-

886

$0.446

$0.366

-

-

Ampacity Inc.

Singapore . 3,319 parts In-Stock

1+ parts

$6.790

100+ parts

-

1k+ parts

-

10k+ parts

-

3,319

$6.790

-

-

-

Corphita

USA . 2,860 parts In-Stock

1+ parts

$7.191

100+ parts

-

1k+ parts

-

10k+ parts

-

2,860

$7.191

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$7.920

100+ parts

$7.524

1k+ parts

-

10k+ parts

$7.049

10

$7.920

$7.524

-

$7.049

Continental Prestige Electronics

USA . 1,357 parts In-Stock

1+ parts

$7.920

100+ parts

-

1k+ parts

-

10k+ parts

$7.762

1,357

$7.920

-

-

$7.762

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$8.078

100+ parts

$8.078

1k+ parts

$8.078

10k+ parts

-

3,000

$8.078

$8.078

$8.078

-

Argo Parts USA

USA . 4,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,353

-

-

-

-

Overview

Enhance your consumer electronics with the Texas Instruments TLV990-28PFB. Designed with precision and quality in mind, this cutting-edge IC offers unmatched performance and reliability. With a wide range of applications in various industries, this product is sure to meet your needs and exceed your expectations. Experience the value and benefits that Texas Instruments brings to the table, and take your projects to the next level with the TLV990-28PFB.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides a lightweight and durable housing for the IC, ensuring longevity and reliability in various applications.

Surface Mount:

YES - Allows for easy and efficient assembly onto circuit boards, saving time and costs during production.

Package Shape:

SQUARE - Offers a compact and space-saving design, making it suitable for smaller electronic devices.

General IC Type:

CONSUMER CIRCUIT - Specifically designed for consumer electronics, ensuring compatibility and optimal performance in everyday devices.

No. of Terminals:

48 - Provides ample connectivity options for various input and output functions, allowing for versatile integration in different systems.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH - Offers a streamlined and efficient package style for high-density mounting on PCBs, optimizing space utilization.

Maximum Operating Temperature:

75 °C - Can withstand elevated temperatures without compromising performance, ensuring reliable operation in challenging environments.

Minimum Operating Temperature:

20 °C - Can function in low-temperature conditions, making it suitable for a wide range of operating environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Enhances conductivity and corrosion resistance, ensuring stable electrical connections over the product's lifespan.

Terminal Position:

QUAD - Provides a secure and stable mounting configuration, reducing the risk of damage and improving overall reliability.

Maximum Seated Height:

1.2 mm - Offers a low-profile design for slim devices, enabling compact and sleek product designs.

Width:

7 mm - Fits easily into standard PCB layouts, facilitating straightforward integration into existing electronic systems.

Minimum Supply Voltage (Vsup):

2.7 V - Operates efficiently with low power requirements, making it energy-efficient and cost-effective to use.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering and assembly processes, promoting reliable connections and long-term performance.

Peak Reflow Temperature °C:

260 - Withstands high-temperature reflow soldering, maintaining structural integrity and electrical functionality during manufacturing.

Length:

7 mm - Offers a balanced size proportion for seamless integration into various electronic devices or systems.

Temperature Grade:

COMMERCIAL EXTENDED - Meets industry standards for temperature range and performance criteria, ensuring compatibility with commercial applications.

Technology:

CMOS - Features advanced CMOS technology for efficient performance, low power consumption, and high-speed operation in consumer electronics.

Terminal Form:

GULL WING - Facilitates easy soldering and secure mounting on PCBs, enhancing assembly efficiency and overall product reliability.

Terminal Pitch:

0.5 mm - Provides a fine pitch layout for high-density mounting, enabling compact design and efficient use of limited space on PCBs.

Moisture Sensitivity Level (MSL):

2 - Suitable for reflow soldering processes and low-level moisture exposure, ensuring component reliability and longevity.

Maximum Supply Voltage (Vsup):

3.3 V - Supports a broad range of supply voltages, making it compatible with a wide variety of electronic systems and circuits.

Technical Specifications

Other Function Consumer ICs TLV990-28PFB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLV990-28PFB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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