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TLV990APFB

Texas Instruments

TLV990APFB by Texas Instruments

TLV990APFB by Texas Instruments is a consumer IC with 48 terminals in a square package. It operates b/w -20°C to 75°C, suitable for commercial extended temperature applications. With a supply voltage range of 2.7V to 3.3V, it is ideal for various electronic devices requiring precise consumer circuit functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,087

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-

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Digiode

USA . 539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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539

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 922 parts In-Stock

1+ parts

$1.406

100+ parts

$130.587

1k+ parts

$1.266

10k+ parts

-

922

$1.406

$130.587

$1.266

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

$1.548

100+ parts

-

1k+ parts

-

10k+ parts

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2,337

$1.548

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ChromeModa Solutions

Germany . 6,032 parts In-Stock

1+ parts

$1.580

100+ parts

$1.296

1k+ parts

-

10k+ parts

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6,032

$1.580

$1.296

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IDEA Electronic Components Group

UK . 282 parts In-Stock

1+ parts

$1.580

100+ parts

-

1k+ parts

$1.422

10k+ parts

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282

$1.580

-

$1.422

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One Stop Electronics

USA . 194 parts In-Stock

1+ parts

$3.800

100+ parts

-

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10k+ parts

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194

$3.800

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AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$6.268

100+ parts

-

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227

$6.268

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Corphita

USA . 1,528 parts In-Stock

1+ parts

-

100+ parts

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1,528

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Overview

Discover the cutting-edge technology of the TLV990APFB by Texas Instruments, a high-quality consumer circuit IC that offers unparalleled performance and reliability. With a sleek square package design and advanced CMOS technology, this versatile component is perfect for a wide range of applications. From automotive to industrial electronics, the TLV990APFB provides exceptional value and benefits to customers looking for top-of-the-line functionality and precise control. Trust Texas Instruments for superior quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to external elements, making this product suitable for various environments.

Surface Mount: YES

With surface mount capability, this product can easily be integrated into modern circuit board designs for compact and efficient layouts.

Package Shape: SQUARE

Square package shape allows for easy handling and placement during assembly, ensuring convenience in manufacturing processes.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronics applications, this IC type offers reliable performance and functionality for end-users.

No. of Terminals: 48

The high number of terminals provides ample connectivity options, enabling versatile use in diverse circuit configurations.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch package style ensures efficient use of space on the circuit board, ideal for compact designs.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand elevated thermal conditions, enhancing its reliability in various applications.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature range allows this product to function effectively even in cold environments, expanding its usability.

Terminal Position: QUAD

Quad terminal position offers increased connectivity options and ease of circuit integration, making this product versatile in circuit designs.

Maximum Seated Height: 1.2 mm

The low maximum seated height contributes to the overall compactness of the product, suitable for space-constrained applications.

Width: 7 mm

The compact width of 7mm allows for efficient use of space on the circuit board, enabling streamlined designs.

Minimum Supply Voltage (Vsup): 2.7 V

With a low minimum supply voltage requirement, this product can operate efficiently even with limited power resources.

Length: 7 mm

The short length of 7mm contributes to the overall compactness of the product, ideal for applications where space is a concern.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable performance over a wide temperature range, making this product suitable for commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of this product.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and easy soldering during assembly, ensuring robust and reliable circuit integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packaging and improved signal integrity, suitable for advanced circuit designs.

Maximum Supply Voltage (Vsup): 3.3 V

With a maximum supply voltage of 3.3V, this product can handle higher voltages, offering flexibility in power supply options.

Technical Specifications

Other Function Consumer ICs TLV990APFB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV990APFB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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