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TLV990PFB

Texas Instruments

TLV990PFB by Texas Instruments

TLV990PFB by Texas Instruments is a 48-terminal IC with 3V power supply, CMOS technology, and -20 to 75°C operating temperature range. It is used in consumer circuits for various applications due to its thin profile, fine pitch flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,154 parts In-Stock

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Digiode

USA . 3,096 parts In-Stock

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3,096

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Distributors (Availability)

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Parana Technologies

USA . 1,191 parts In-Stock

1+ parts

$3.079

100+ parts

-

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$3.593

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1,191

$3.079

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$3.593

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DigiPath Technology Company

USA . 1,632 parts In-Stock

1+ parts

$3.390

100+ parts

$3.119

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1,632

$3.390

$3.119

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ChromeModa Solutions

Germany . 6,570 parts In-Stock

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$3.459

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$2.836

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6,570

$3.459

$2.836

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IDEA Electronic Components Group

UK . 607 parts In-Stock

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$3.459

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$3.113

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607

$3.459

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$3.113

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AZTECH Wire

Italy . 260 parts In-Stock

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$11.516

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260

$11.516

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One Stop Electronics

USA . 1,332 parts In-Stock

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$20.800

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1,332

$20.800

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A-Z Elektronik GmbH

Germany . 5,966 parts In-Stock

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Corphita

USA . 3,824 parts In-Stock

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3,824

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Assy Fe

Spain . 1,731 parts In-Stock

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Overview

Unlock a world of possibilities with the TLV990PFB by Texas Instruments. Manufactured with precision and expertise, this consumer IC offers unmatched quality and reliability. Perfect for a wide range of applications, this IC provides customers with exceptional value and performance. Experience seamless operation and efficiency like never before with the TLV990PFB. Elevate your projects with Texas Instruments' cutting-edge technology and trust in the innovation that sets us apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides high durability and resistance to external elements, making the product suitable for a wide range of environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing production costs.

Package Shape: SQUARE

Square package shape simplifies PCB layout and offers good thermal management for the IC.

Power Supplies (V): 3

Operating at a standard 3V power supply ensures compatibility with common power sources.

No. of Terminals: 48

With 48 terminals, the IC can accommodate a variety of inputs and outputs, enabling versatile functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style allows for compact design and efficient signal routing on the PCB.

Maximum Operating Temperature: 75 °C

High maximum operating temperature of 75°C ensures reliable performance even in challenging thermal conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature of -20°C enables the IC to function in cold environments without issues.

Terminal Position: QUAD

Quad terminal position facilitates easy placement and soldering on the PCB, enhancing manufacturing efficiency.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2 mm allows for compact and streamlined product design.

Width: 7 mm

Narrow width of 7 mm enables space-saving integration into compact electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement of 2.7 V ensures efficient power usage and compatibility with various power sources.

Length: 7 mm

Short length of 7 mm contributes to a small form factor design, ideal for applications with limited space.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation across a wide range of temperatures typically encountered in commercial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and performance of the IC.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and allows for easy soldering during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density packaging and contributes to the compact size of the IC.

Maximum Supply Voltage (Vsup): 3.3 V

Maximum supply voltage of 3.3 V ensures safe operation within specified voltage limits, protecting the IC from potential damage.

Technical Specifications

Other Function Consumer ICs TLV990PFB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV990PFB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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