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TSC2301IPAGR

Texas Instruments

TSC2301IPAGR by Texas Instruments

TSC2301IPAGR by Texas Instruments is a 64-terminal IC with 3.3V power supply, operating b/w -40 to 85°C. It features a thin profile flatpack package suitable for consumer circuits in industrial applications. With nickel palladium gold finish and quad terminal position, it offers high performance at peak reflow temperature of 260°C.

Median Price

$9.636

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,050 parts In-Stock

1+ parts

$8.584

100+ parts

$7.498

1k+ parts

$5.171

10k+ parts

-

11,050

$8.584

$7.498

$5.171

-

Rochester

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

$8.550

1k+ parts

$7.650

10k+ parts

$7.200

1,300

-

$8.550

$7.650

$7.200

DigiKey

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

$11.250

1k+ parts

-

10k+ parts

-

1,300

-

$11.250

-

-

Verical

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

$10.688

1k+ parts

$9.563

10k+ parts

$9.000

1,300

-

$10.688

$9.563

$9.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$6.466

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$6.466

-

-

-

Digiode

USA . 4,633 parts In-Stock

1+ parts

$6.821

100+ parts

-

1k+ parts

-

10k+ parts

-

4,633

$6.821

-

-

-

Vyrian

USA . 4,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,220

-

-

-

-

DigiKey Marketplace

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,499 parts In-Stock

1+ parts

$0.765

100+ parts

$71.079

1k+ parts

$0.689

10k+ parts

-

1,499

$0.765

$71.079

$0.689

-

DigiPath Technology Company

USA . 1,905 parts In-Stock

1+ parts

$0.843

100+ parts

$0.775

1k+ parts

-

10k+ parts

-

1,905

$0.843

$0.775

-

-

ChromeModa Solutions

Germany . 6,462 parts In-Stock

1+ parts

$0.860

100+ parts

$0.705

1k+ parts

-

10k+ parts

-

6,462

$0.860

$0.705

-

-

IDEA Electronic Components Group

UK . 306 parts In-Stock

1+ parts

$0.860

100+ parts

-

1k+ parts

$0.774

10k+ parts

-

306

$0.860

-

$0.774

-

Ampacity Inc.

Singapore . 4,256 parts In-Stock

1+ parts

$6.100

100+ parts

-

1k+ parts

-

10k+ parts

-

4,256

$6.100

-

-

-

Semicontronic

India . 4,217 parts In-Stock

1+ parts

$6.100

100+ parts

$5.948

1k+ parts

$5.917

10k+ parts

-

4,217

$6.100

$5.948

$5.917

-

Corphita

USA . 656 parts In-Stock

1+ parts

$6.462

100+ parts

-

1k+ parts

-

10k+ parts

-

656

$6.462

-

-

-

Continental Prestige Electronics

USA . 6,309 parts In-Stock

1+ parts

$6.466

100+ parts

-

1k+ parts

-

10k+ parts

$6.337

6,309

$6.466

-

-

$6.337

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.466

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$6.466

-

-

-

Vigor

Singapore . 1,500 parts In-Stock

1+ parts

$7.450

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

$7.450

-

-

-

Argo Parts USA

USA . 1,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,329

-

-

-

-

Kepictronics

USA . 195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

195

-

-

-

-

Overview

Experience innovation like never before with the Texas Instruments TSC2301IPAGR. Crafted with precision and quality, this consumer circuit IC offers unparalleled performance in various applications. From smart home devices to automotive electronics, this versatile product guarantees reliability and efficiency. Elevate your projects with the cutting-edge technology of Texas Instruments and enjoy the seamless integration and exceptional value that the TSC2301IPAGR brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and lightweight, ideal for consumer applications.

Surface Mount: YES

The surface mount feature makes it easy to integrate this IC into electronic devices efficiently.

Package Shape: SQUARE

The square package shape allows for easier placement and alignment on circuit boards.

Power Supplies (V): 3.3

The 3.3V power supply is suitable for a wide range of consumer electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C ensures reliable performance in both extreme cold and hot conditions.

Technology: CMOS

The CMOS technology used in this IC provides low power consumption and high noise immunity, making it efficient for consumer applications.

Technical Specifications

Other Function Consumer ICs TSC2301IPAGR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TSC2301IPAGR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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