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TSC2004IRTJRG4

Texas Instruments

TSC2004IRTJRG4 by Texas Instruments

TSC2004IRTJRG4 by Texas Instruments is a consumer IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With power supplies of 1.2-3.6V, it's ideal for various consumer circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,146 parts In-Stock

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8,146

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Digiode

USA . 2,589 parts In-Stock

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2,589

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

$1.905

100+ parts

-

1k+ parts

$2.443

10k+ parts

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1,829

$1.905

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$2.443

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DigiPath Technology Company

USA . 877 parts In-Stock

1+ parts

$2.097

100+ parts

$1.929

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877

$2.097

$1.929

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ChromeModa Solutions

Germany . 4,376 parts In-Stock

1+ parts

$2.140

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$1.755

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$2.140

$1.755

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IDEA Electronic Components Group

UK . 2,160 parts In-Stock

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$2.140

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$1.926

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2,160

$2.140

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$1.926

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Corohmni

South Africa . 22 parts In-Stock

1+ parts

$3.897

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22

$3.897

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One Stop Electronics

USA . 1,460 parts In-Stock

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$11.800

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$11.800

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AZTECH Wire

Italy . 640 parts In-Stock

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$15.982

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640

$15.982

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Semicontronic

India . 296 parts In-Stock

1+ parts

$17.800

100+ parts

$17.355

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$17.266

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296

$17.800

$17.355

$17.266

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Ampacity Inc.

Singapore . 807 parts In-Stock

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$21.800

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807

$21.800

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A-Z Elektronik GmbH

Germany . 7,143 parts In-Stock

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Corphita

USA . 4,945 parts In-Stock

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Argo Parts USA

USA . 4,136 parts In-Stock

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4,136

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Continental Prestige Electronics

USA . 2,980 parts In-Stock

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2,980

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Advanced Electronics

New Zealand . 86 parts In-Stock

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86

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Bastille Electronics

Australia . 77 parts In-Stock

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77

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Overview

Discover the innovative TSC2004IRTJRG4 by Texas Instruments, a high-quality consumer IC that offers reliability and performance. This versatile chip carrier is ideal for a wide range of applications, providing customers with a durable solution for their electronic needs. With a compact design and industrial-grade temperature tolerance, this Texas Instruments product ensures longevity and efficiency. Upgrade your electronics with the cutting-edge technology of the TSC2004IRTJRG4 and experience the superior benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the IC, making it durable and long-lasting.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring compatibility and optimal performance in everyday devices.

Power Supplies (V): 1.2/3.6

Supports a wide range of power supplies, making it versatile and adaptable to various applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently even in high temperature environments, increasing its reliability and performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, making it energy-efficient and fast.

Technical Specifications

Other Function Consumer ICs TSC2004IRTJRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TSC2004IRTJRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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