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TRF7960RHBT

Texas Instruments

TRF7960RHBT by Texas Instruments

TRF7960RHBT by Texas Instruments is a consumer IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 110 °C, with Vsup ranging from 2.7V to 5.5V. Ideal for industrial applications requiring very thin profile and surface mount compatibility.

Median Price

$7.234

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,145 parts In-Stock

1+ parts

$6.569

100+ parts

$5.355

1k+ parts

$3.570

10k+ parts

-

25,145

$6.569

$5.355

$3.570

-

Chip1Stop

Japan . 29 parts In-Stock

1+ parts

$7.900

100+ parts

$4.790

1k+ parts

$4.210

10k+ parts

-

29

$7.900

$4.790

$4.210

-

DigiKey

USA . 2,279 parts In-Stock

1+ parts

$9.270

100+ parts

$7.033

1k+ parts

$6.299

10k+ parts

$6.132

2,279

$9.270

$7.033

$6.299

$6.132

Mouser Electronics

USA . 883 parts In-Stock

1+ parts

$9.270

100+ parts

$7.040

1k+ parts

$5.630

10k+ parts

-

883

$9.270

$7.040

$5.630

-

Rochester

USA . 211 parts In-Stock

1+ parts

-

100+ parts

$5.140

1k+ parts

$4.600

10k+ parts

$4.330

211

-

$5.140

$4.600

$4.330

Verical

USA . 211 parts In-Stock

1+ parts

-

100+ parts

$6.425

1k+ parts

$5.750

10k+ parts

$5.412

211

-

$6.425

$5.750

$5.412

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,556 parts In-Stock

1+ parts

$4.712

100+ parts

-

1k+ parts

-

10k+ parts

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3,556

$4.712

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.830

100+ parts

-

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-

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10

$4.830

-

-

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Vyrian

USA . 6,039 parts In-Stock

1+ parts

-

100+ parts

-

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6,039

-

-

-

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ComSIT Distribution GmbH

Germany . 1,048 parts In-Stock

1+ parts

-

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1,048

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-

-

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Bristol Electronics

USA . 463 parts In-Stock

1+ parts

-

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463

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PC Components Company LLC

USA . 200 parts In-Stock

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200

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-

-

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Dan-Mar Components

USA . 152 parts In-Stock

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152

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Inventory MP

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,291 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

$1.982

10k+ parts

-

2,291

$1.178

-

$1.982

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ChromeModa Solutions

Germany . 4,516 parts In-Stock

1+ parts

$1.324

100+ parts

$1.086

1k+ parts

-

10k+ parts

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4,516

$1.324

$1.086

-

-

IDEA Electronic Components Group

UK . 553 parts In-Stock

1+ parts

$1.324

100+ parts

-

1k+ parts

$1.192

10k+ parts

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553

$1.324

-

$1.192

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Corohmni

South Africa . 192 parts In-Stock

1+ parts

$3.283

100+ parts

-

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192

$3.283

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Ampacity Inc.

Singapore . 6,098 parts In-Stock

1+ parts

$4.220

100+ parts

-

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6,098

$4.220

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Corphita

USA . 750 parts In-Stock

1+ parts

$4.464

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-

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750

$4.464

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Continental Prestige Electronics

USA . 6,633 parts In-Stock

1+ parts

$4.830

100+ parts

-

1k+ parts

-

10k+ parts

$4.733

6,633

$4.830

-

-

$4.733

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.830

100+ parts

$4.733

1k+ parts

-

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500

$4.830

$4.733

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Perfect Parts

USA . 23,354 parts In-Stock

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23,354

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A-Z Elektronik GmbH

Germany . 4,533 parts In-Stock

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4,533

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DigiPath Technology Company

USA . 1,688 parts In-Stock

1+ parts

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$1.194

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1,688

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$1.194

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Lixinc

USA . 1,337 parts In-Stock

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1,337

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Argo Parts USA

USA . 1,208 parts In-Stock

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Kepictronics

USA . 44 parts In-Stock

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44

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Overview

Discover the cutting-edge TRF7960RHBT by Texas Instruments, a revolutionary consumer IC that redefines innovation and reliability. With Texas Instruments' renowned reputation for excellence in manufacturing, this chip carrier features advanced technology in a compact design perfect for various industrial applications. Experience the unbeatable quality and performance of the TRF7960RHBT, offering customers unmatched value, efficiency, and durability. Embrace the future of technology with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making this product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape offers efficient use of board space and facilitates uniform placement within electronic systems.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for performance, reliability, and cost-effectiveness in everyday electronic devices.

No. of Terminals: 32

Having 32 terminals provides the necessary connectivity options for complex circuit configurations and enhances the versatility of the product.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this IC can withstand demanding thermal conditions and maintain stable performance in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operational functionality even in extreme cold climates or refrigerated environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and solderability for reliable connections and extended product longevity.

Terminal Position: QUAD

The quad terminal position simplifies the soldering process and promotes efficient heat dissipation, enhancing overall performance and reliability.

Maximum Seated Height: 1 mm

With a low seated height, this IC can be easily integrated into compact electronic devices with space constraints, enabling sleek and streamlined designs.

Width: 5 mm

The 5mm width provides a compact form factor for the IC, allowing for space-efficient placement on circuit boards and enhancing overall system integration.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement makes this IC energy-efficient and suitable for battery-powered devices, prolonging battery life and reducing power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and thermal stability during the assembly process, preventing damage to the IC.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand high thermal stress during soldering without compromising its performance or reliability.

Length: 5 mm

The 5mm length contributes to the compact size of the IC, enabling efficient usage of board space and facilitating optimization of circuit layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that this IC is suitable for operation in a wide range of temperature environments, ensuring consistent performance in various industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and complies with environmental regulations, making this IC a sustainable and eco-friendly choice.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on circuit boards, enabling more compact designs and efficient use of board space.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this IC is moderately sensitive to moisture exposure during storage and handling, requiring standard precautions to prevent moisture-related damage.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources and ensures robust performance in various operating conditions.

Technical Specifications

Other Function Consumer ICs TRF7960RHBT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TRF7960RHBT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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