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UDA1351TS/N1,518

NXP Semiconductors

UDA1351TS/N1,518 by NXP Semiconductors

NXP Semiconductors UDA1351TS/N1,518 is a consumer IC with 28 terminals. It operates b/w -40°C to 85°C and has a supply voltage range of 2.7V to 3.6V. This small outline IC in plastic package is ideal for industrial applications requiring compact design and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,029 parts In-Stock

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4,029

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Vyrian

USA . 2,774 parts In-Stock

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2,774

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Anansix

USA . 145 parts In-Stock

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145

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Distributors (Availability)

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AZTECH Wire

Italy . 250 parts In-Stock

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$10.130

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250

$10.130

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One Stop Electronics

USA . 262 parts In-Stock

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$16.800

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262

$16.800

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Ampacity Inc.

Singapore . 891 parts In-Stock

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$20.800

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891

$20.800

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Component Stockers USA

USA . 578 parts In-Stock

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$99.990

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578

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 4,957 parts In-Stock

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4,957

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Continental Prestige Electronics

USA . 4,787 parts In-Stock

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4,787

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Corphita

USA . 4,622 parts In-Stock

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Microchip USA

USA . 3,306 parts In-Stock

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UNI Independent Distributors

Spain . 3,188 parts In-Stock

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Argo Parts USA

USA . 2,649 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your consumer electronics with the UDA1351TS/N1,518 by NXP Semiconductors, a top-tier manufacturer known for quality and innovation. This small outline IC offers a wide range of applications in various consumer circuits, delivering exceptional performance and reliability. With a temperature grade suitable for industrial use, high-quality plastic/epoxy material, and a dual terminal position, this product ensures seamless integration and long-lasting functionality. Trust NXP Semiconductors to provide cutting-edge solutions that enhance your products and exceed customer expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the IC, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time during production.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding environmental conditions and maintain reliable functionality.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7 V allows for flexibility in power sources and compatibility with various systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting and space-saving design in electronic applications.

Technical Specifications

Other Function Consumer ICs UDA1351TS/N1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

UDA1351TS/N1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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