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UDA1380HN/N2,118

NXP Semiconductors

UDA1380HN/N2,118 by NXP Semiconductors

NXP Semiconductors UDA1380HN/N2,118 is a 32-terminal consumer IC with operating temperatures from -40 to 85°C. It has a supply voltage range of 2.4V to 3.6V and peak reflow temperature of 260°C. This chip carrier is ideal for industrial applications requiring very thin profile and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 7,921 parts In-Stock

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Digiode

USA . 3,158 parts In-Stock

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Anansix

USA . 2,036 parts In-Stock

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Bristol Electronics

USA . 683 parts In-Stock

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Sensible Micro Corp

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Corohmni

South Africa . 101 parts In-Stock

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$1.505

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Aztec Data Supply Inc.

USA . 4,421 parts In-Stock

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Ampacity Inc.

Singapore . 1,529 parts In-Stock

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AZTECH Wire

Italy . 782 parts In-Stock

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Microchip USA

USA . 392 parts In-Stock

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One Stop Electronics

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UNI Independent Distributors

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Perfect Parts

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Argo Parts USA

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Authorized Procurement Solutions

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Corphita

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Continental Prestige Electronics

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XScomponents

USA . 620 parts In-Stock

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Aranea Global

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Overview

Enhance your audio experience with the UDA1380HN/N2,118 by NXP Semiconductors. Known for their top-quality manufacturing, NXP Semiconductors delivers excellence in the category of Other Function Consumer ICs. This versatile chip carrier boasts a very thin profile and heat sink/slug package style, making it ideal for a wide range of consumer circuit applications. With a wide operating temperature range and low supply voltage requirements, the UDA1380HN/N2,118 offers customers exceptional value, reliability, and performance. Upgrade your electronic projects with this innovative solution from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable housing for the IC, making it suitable for consumer applications.

Surface Mount: YES

The surface mount option allows for easy installation and space-saving on PCBs, making it efficient for circuit design.

Package Shape: SQUARE

The square shape of the package offers a compact footprint, ideal for space-constrained designs in consumer electronics.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring compatibility and optimal performance in such devices.

No. of Terminals: 32

With a high number of terminals, this IC can handle complex functions and interfaces, making it versatile for various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides efficient thermal management and space-saving benefits, enhancing the overall performance of the IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IC is suitable for use in extreme cold environments.

Terminal Position: QUAD

The quad terminal position offers a secure connection and efficient signal transmission, ensuring reliable operation of the IC.

Maximum Seated Height: 1 mm

The low seated height makes this IC suitable for slim and compact devices, optimizing space utilization in consumer electronics.

Width: 5 mm

The narrow width of the IC contributes to its compact design, making it a space-efficient choice for integrated circuits.

Minimum Supply Voltage (Vsup): 2.4 V

With a low minimum supply voltage, this IC is energy-efficient and suitable for battery-powered consumer devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure solder joints during the manufacturing process, contributing to the reliability of the IC.

Length: 5 mm

The short length of the IC enhances its compactness, making it an ideal choice for small form factor electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this IC offers robust performance and reliability in demanding operating conditions.

Terminal Form: NO LEAD

The absence of lead terminals reduces environmental impact and ensures compliance with RoHS regulations, making it an environmentally friendly choice.

Terminal Pitch: 0.5 mm

The small terminal pitch provides high-density packing on PCBs, enabling the integration of multiple functions in a limited space.

Maximum Supply Voltage (Vsup): 3.6 V

With a high maximum supply voltage, this IC can handle power fluctuations and deliver stable performance in consumer devices.

Technical Specifications

Other Function Consumer ICs UDA1380HN/N2,118 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

UDA1380HN/N2,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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