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UDA1341TS

NXP Semiconductors

UDA1341TS by NXP Semiconductors

NXP Semiconductors' UDA1341TS is a 28-terminal consumer IC with a power supply of 3V. It operates b/w -20°C to 85°C, suitable for various consumer circuit applications. The small outline package measures 10.2mm x 5.3mm, making it ideal for compact electronic devices.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 24 parts In-Stock

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$6.720

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$3.360

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Vyrian

USA . 2,603 parts In-Stock

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Anansix

USA . 1,488 parts In-Stock

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Digiode

USA . 513 parts In-Stock

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513

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Q Components

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290

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ACDS - Activité Composants Distribution Service

France . 24 parts In-Stock

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Dan-Mar Components

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Sinequanon

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LIBRA Elektronik GmbH

Germany . 8 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 425 parts In-Stock

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$2.427

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$2.427

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One Stop Electronics

USA . 1,203 parts In-Stock

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$3.800

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Ampacity Inc.

Singapore . 346 parts In-Stock

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$18.800

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Kepictronics

USA . 5,700 parts In-Stock

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UNI Independent Distributors

Spain . 4,918 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Assy Fe

Spain . 1,000 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Experience superior sound quality and exceptional performance with the UDA1341TS by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-notch products that meet the highest standards. This versatile consumer IC is perfect for a wide range of applications, providing reliable audio processing capabilities. With a compact package design and advanced features, the UDA1341TS offers unmatched value and benefits to customers looking for a high-quality solution. Upgrade your audio experience today with NXP Semiconductors!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in consumer electronics for its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier automated assembly, making the product more efficient.

Package Shape: RECTANGULAR

Rectangular package shape is common and convenient for mounting on circuit boards.

Power Supplies (V): 3

The 3V power supply is suitable for consumer electronic applications, providing enough power without being too high.

No. of Terminals: 28

Having 28 terminals allows for more connectivity options and functionality in the circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design save space on the circuit board, making the product more compact and efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand a wide range of environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature enables the product to work in colder environments without performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides a reliable and durable connection, ensuring long-term functionality of the product.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit design and connectivity options.

Maximum Seated Height: 2 mm

The low seated height makes the product suitable for compact designs and applications where space is limited.

Width: 5.3 mm

The compact width of the product allows for more efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup): 2.4 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and applications.

Length: 10.2 mm

The length of 10.2 mm is suitable for compact designs and applications where space is limited.

Terminal Form: GULL WING

The gull wing terminal form is commonly used for surface mount components, providing a reliable connection and easy assembly.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for more terminals in a compact space, increasing the functionality of the product.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the product is moderately sensitive to moisture, making it suitable for indoor consumer electronic applications.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides flexibility in power supply options while ensuring safe operation of the product.

Technical Specifications

Other Function Consumer ICs UDA1341TS attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

UDA1341TS General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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