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UDA1355H

NXP Semiconductors

UDA1355H by NXP Semiconductors

NXP Semiconductors UDA1355H is a 44-terminal consumer IC with operating temperature range of -40 to 85°C. It features a supply voltage range of 2.7V to 3.6V and peak reflow temperature of 260°C, suitable for industrial applications requiring compact design and high performance in a square flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,151 parts In-Stock

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Digiode

USA . 1,847 parts In-Stock

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Vyrian

USA . 1,291 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Connector Distribution Corp

USA . 24 parts In-Stock

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Right Parts Inc.

USA . 24 parts In-Stock

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LWI Electronics Inc

India . 18 parts In-Stock

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One Stop Electronics

USA . 615 parts In-Stock

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$11.800

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Ampacity Inc.

Singapore . 354 parts In-Stock

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$15.800

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AZTECH Wire

Italy . 512 parts In-Stock

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$15.960

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Lixinc

USA . 6,140 parts In-Stock

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Argo Parts USA

USA . 4,909 parts In-Stock

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UNI Independent Distributors

Spain . 4,431 parts In-Stock

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Corphita

USA . 2,527 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 773 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Overview

Unlock the next level of audio excellence with the UDA1355H by NXP Semiconductors. This top-of-the-line consumer IC delivers unparalleled quality and performance, perfect for a wide range of applications. With NXP's reputation for reliability and innovation, you can trust that this product will exceed your expectations. Experience crystal-clear sound and seamless integration with the UDA1355H, offering unbeatable value and benefits to all customers seeking premium audio solutions. Upgrade your audio experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal circuits and components, ensuring durability and reliability.

Surface Mount: YES

Easier and more efficient installation on PCBs, saving time and resources during assembly.

Package Shape: SQUARE

A compact and space-efficient design that can fit well in a variety of electronic devices.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, ensuring compatibility with a wide range of products.

No. of Terminals: 44

Provides ample connectivity options for various functions and interfaces, making it versatile for different applications.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environmental conditions, suitable for industrial and outdoor use.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a wide range of supply voltages, making it flexible and adaptable to different power sources.

Technical Specifications

Other Function Consumer ICs UDA1355H attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

UDA1355H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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