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TIOL1115DMWR

Texas Instruments

TIOL1115DMWR by Texas Instruments

TIOL1115DMWR by Texas Instruments is a small outline, heat sink IC with 10 terminals. Operating b/w -40 to 125°C, it has a supply voltage range of 3-3.6V and can handle up to 350mA current. Ideal for automotive applications due to its nickel palladium gold finish and moisture sensitivity level of 2.

Median Price

$4.172

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,980 parts In-Stock

1+ parts

$3.363

100+ parts

$2.947

1k+ parts

$1.665

10k+ parts

-

33,980

$3.363

$2.947

$1.665

-

Mouser Electronics

USA . 605 parts In-Stock

1+ parts

$4.980

100+ parts

$4.240

1k+ parts

$2.650

10k+ parts

$2.580

605

$4.980

$4.240

$2.650

$2.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$2.570

-

-

-

Digiode

USA . 1,614 parts In-Stock

1+ parts

$3.195

100+ parts

-

1k+ parts

-

10k+ parts

-

1,614

$3.195

-

-

-

Vyrian

USA . 17,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,537

-

-

-

-

Chip Stock

USA . 7,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,690

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 796 parts In-Stock

1+ parts

$1.507

100+ parts

-

1k+ parts

$2.172

10k+ parts

-

796

$1.507

-

$2.172

-

DigiPath Technology Company

USA . 1,915 parts In-Stock

1+ parts

$1.659

100+ parts

$1.526

1k+ parts

-

10k+ parts

-

1,915

$1.659

$1.526

-

-

ChromeModa Solutions

Germany . 1,725 parts In-Stock

1+ parts

$1.693

100+ parts

$1.388

1k+ parts

-

10k+ parts

-

1,725

$1.693

$1.388

-

-

IDEA Electronic Components Group

UK . 1,162 parts In-Stock

1+ parts

$1.693

100+ parts

-

1k+ parts

$1.524

10k+ parts

-

1,162

$1.693

-

$1.524

-

Corohmni

South Africa . 344 parts In-Stock

1+ parts

$2.117

100+ parts

-

1k+ parts

-

10k+ parts

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344

$2.117

-

-

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Continental Prestige Electronics

USA . 3,160 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

$2.519

3,160

$2.570

-

-

$2.519

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$2.570

-

-

-

Argo Parts USA

USA . 493 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

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493

$2.570

-

-

-

Semicontronic

India . 17,467 parts In-Stock

1+ parts

$2.860

100+ parts

$2.788

1k+ parts

$2.774

10k+ parts

-

17,467

$2.860

$2.788

$2.774

-

Ampacity Inc.

Singapore . 17,090 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

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17,090

$2.860

-

-

-

Corphita

USA . 2,679 parts In-Stock

1+ parts

$3.027

100+ parts

-

1k+ parts

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10k+ parts

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2,679

$3.027

-

-

-

Lixinc

USA . 10,416 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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10,416

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-

-

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Overview

Discover the TIOL1115DMWR by Texas Instruments, a cutting-edge Consumer IC designed to elevate your electronics projects. Manufactured by the industry leader in semiconductor technology, this high-quality IC offers unparalleled performance and reliability. With its compact design and wide operating temperature range, this versatile component is perfect for a variety of applications. Experience the value and benefits of the TIOL1115DMWR and take your projects to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to moisture and corrosion, making this product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving space and reducing production costs.

Package Shape: RECTANGULAR

Rectangular packages are common and easy to handle, making the product compatible with standard manufacturing processes.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this product can function reliably in extreme environments, suitable for automotive and industrial applications.

Maximum Seated Height: 1 mm

Low profile design enables compact and space-saving PCB layouts, ideal for applications where size constraints are a concern.

Minimum Supply Voltage (Vsup): 3 V

This low minimum supply voltage requirement allows the product to operate efficiently even in low power conditions, saving energy.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product has a moderate sensitivity to moisture, ensuring reliable performance in standard manufacturing and operating conditions.

Technical Specifications

Other Function Consumer ICs TIOL1115DMWR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

350 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

TIOL1115DMWR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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