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UDA1355H/N2,518

NXP Semiconductors

UDA1355H/N2,518 by NXP Semiconductors

NXP Semiconductors UDA1355H/N2,518 is a 44-terminal consumer circuit IC with operating temperature range of -40 to 85°C. It features a supply voltage range of 2.7V to 3.6V and comes in a square flatpack package style. Ideal for industrial applications requiring compact design and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,077 parts In-Stock

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Digiode

USA . 3,540 parts In-Stock

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Anansix

USA . 1,764 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Ampacity Inc.

Singapore . 631 parts In-Stock

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$4.800

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631

$4.800

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AZTECH Wire

Italy . 359 parts In-Stock

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$4.918

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One Stop Electronics

USA . 415 parts In-Stock

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$12.800

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QUARKTWIN TECHNOLOGY LTD

USA . 11,043 parts In-Stock

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UNI Independent Distributors

Spain . 6,696 parts In-Stock

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Continental Prestige Electronics

USA . 4,946 parts In-Stock

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Microchip USA

USA . 3,888 parts In-Stock

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Argo Parts USA

USA . 3,858 parts In-Stock

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Corphita

USA . 1,438 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience top-notch quality and innovation with the UDA1355H/N2,518 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers cutting-edge technology for consumer ICs like never before. With a durable plastic/epoxy body and surface mount design, this versatile IC is perfect for a wide range of applications. From audio equipment to electronic gadgets, this product offers exceptional value and reliability. Discover the endless possibilities and benefits that the UDA1355H/N2,518 can bring to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection and insulation for the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

Package Shape: SQUARE

The square package shape may offer better space utilization and easier handling during assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs UDA1355H/N2,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

UDA1355H/N2,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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