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LM4550BVHX/NOPB

Texas Instruments

LM4550BVHX/NOPB by Texas Instruments

LM4550BVHX/NOPB by Texas Instruments is a consumer IC with 48 terminals, operating at -40 to 85°C. It has power supplies of 3.3/5,5V and a terminal pitch of 0.5mm. Ideal for industrial applications requiring low profile, fine pitch packages in a square shape.

Median Price

$4.154

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,486 parts In-Stock

1+ parts

$4.920

100+ parts

$4.011

1k+ parts

$2.674

10k+ parts

-

15,486

$4.920

$4.011

$2.674

-

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.388

10k+ parts

-

1,000

-

-

$3.388

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$3.519

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$3.519

-

-

-

Digiode

USA . 3,869 parts In-Stock

1+ parts

$4.674

100+ parts

-

1k+ parts

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10k+ parts

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3,869

$4.674

-

-

-

Vyrian

USA . 8,145 parts In-Stock

1+ parts

-

100+ parts

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8,145

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-

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Anansix

USA . 1,597 parts In-Stock

1+ parts

-

100+ parts

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1,597

-

-

-

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Bristol Electronics

USA . 700 parts In-Stock

1+ parts

-

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700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 90 parts In-Stock

1+ parts

$0.781

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$0.781

-

-

-

Parana Technologies

USA . 147 parts In-Stock

1+ parts

$1.167

100+ parts

-

1k+ parts

$1.974

10k+ parts

-

147

$1.167

-

$1.974

-

DigiPath Technology Company

USA . 1,887 parts In-Stock

1+ parts

$1.285

100+ parts

$1.182

1k+ parts

-

10k+ parts

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1,887

$1.285

$1.182

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IDEA Electronic Components Group

UK . 1,958 parts In-Stock

1+ parts

$1.311

100+ parts

-

1k+ parts

$1.180

10k+ parts

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1,958

$1.311

-

$1.180

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ChromeModa Solutions

Germany . 805 parts In-Stock

1+ parts

$1.311

100+ parts

$1.075

1k+ parts

-

10k+ parts

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805

$1.311

$1.075

-

-

Ampacity Inc.

Singapore . 7,806 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

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10k+ parts

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7,806

$2.880

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-

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Continental Prestige Electronics

USA . 5,946 parts In-Stock

1+ parts

$3.519

100+ parts

-

1k+ parts

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10k+ parts

$3.448

5,946

$3.519

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-

$3.448

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.519

100+ parts

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2,000

$3.519

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-

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Argo Parts USA

USA . 1,712 parts In-Stock

1+ parts

$3.519

100+ parts

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1k+ parts

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1,712

$3.519

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Corphita

USA . 4,457 parts In-Stock

1+ parts

$4.428

100+ parts

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4,457

$4.428

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Component Stockers USA

USA . 19,545 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.890

10k+ parts

$2.890

19,545

-

-

$2.890

$2.890

Authorized Procurement Solutions

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,100

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Overview

Experience unparalleled quality and reliability with the LM4550BVHX/NOPB by Texas Instruments, a leading manufacturer in the industry. This versatile consumer IC offers a wide range of applications, making it a valuable addition to any project. With its durable construction and innovative design, customers can trust that this product will deliver exceptional performance every time. Discover the countless benefits and advantages that the LM4550BVHX/NOPB brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal circuitry.

Surface Mount: YES

This allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape helps in optimizing space on the circuit board, especially in applications where space is limited.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring compatibility and performance in various consumer devices.

Power Supplies (V): 3.3/5,5

Compatible with multiple power supply voltages, offering flexibility and versatility in different operating environments.

No. of Terminals: 48

The high number of terminals allows for a wide range of connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design enables the IC to be compact and efficient in space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides a reliable and consistent connection for improved signal transmission and overall performance.

Terminal Position: QUAD

The quad terminal position enhances stability and connectivity, making it suitable for applications where secure connections are essential.

Maximum Seated Height: 1.4 mm

The low seated height allows for a slim profile, ideal for applications with height restrictions.

Width: 7 mm

The compact width makes the IC suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 4.2 V

The low minimum supply voltage ensures efficient operation and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature allows for thorough soldering and reliable connections during the manufacturing process.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the IC can withstand the soldering process without damage, ensuring robust construction.

Length: 7 mm

The compact length of the IC contributes to space-saving designs and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance in rugged environments.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections in demanding applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and compact designs, making it ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the IC is suitable for a wide range of storage and operating conditions.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage provides compatibility with various power sources and ensures robust performance in different operating environments.

Technical Specifications

Other Function Consumer ICs LM4550BVHX/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3V TO 5.5V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LM4550BVHX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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