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MC1496BPG

Onsemi

MC1496BPG by Onsemi

MC1496BPG by Onsemi is a consumer IC with 14 terminals in an in-line package. It operates b/w -40 to 125 °C, with a supply voltage of 12V and current of 9mA. Widely used in automotive applications due to its robust design and temperature grade.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 52,000 parts In-Stock

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Vyrian

USA . 5,389 parts In-Stock

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5,389

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Digiode

USA . 807 parts In-Stock

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807

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Inventory MP

USA . 51 parts In-Stock

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Bristol Electronics

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Aztec Data Supply Inc.

USA . 3,877 parts In-Stock

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$0.660

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$0.660

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Ampacity Inc.

Singapore . 395 parts In-Stock

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$2.800

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395

$2.800

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AZTECH Wire

Italy . 271 parts In-Stock

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$12.950

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 5,706 parts In-Stock

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Argo Parts USA

USA . 4,380 parts In-Stock

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Continental Prestige Electronics

USA . 3,957 parts In-Stock

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Kulean Microsystems

USA . 2,885 parts In-Stock

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Corphita

USA . 1,693 parts In-Stock

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SupplyDigital Components

Austria . 1,675 parts In-Stock

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UHIMA Technologies

Türkiye . 374 parts In-Stock

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374

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Problanco Electronics

Mexico . 257 parts In-Stock

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Corohmni

South Africa . 123 parts In-Stock

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Bastille Electronics

Australia . 34 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Experience superior performance and reliability with the MC1496BPG by Onsemi, a leading manufacturer in the industry. This versatile consumer IC offers exceptional value and benefits across various applications. Enhance your circuits with its advanced features and high-quality construction, delivering consistent results at temperatures ranging from -40°C to 125°C. Trust Onsemi for cutting-edge technology and innovation that meets your needs and exceeds your expectations. Upgrade your projects today with the MC1496BPG and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and integration into various systems.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting the IC to other components in a circuit.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the IC to operate in extreme conditions.

Maximum Supply Current: 9 mA

Low supply current consumption makes this IC efficient in terms of power usage.

Technical Specifications

Other Function Consumer ICs MC1496BPG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.19 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC1496BPG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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