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MC1496BDR2

Onsemi

MC1496BDR2 by Onsemi

MC1496BDR2 by Onsemi is a 14-terminal IC with small outline package. It operates b/w -40 to 125 °C, suitable for automotive applications. With peak reflow temp of 235 °C and max supply voltage of 12V, it's ideal for consumer circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 23,500 parts In-Stock

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Vyrian

USA . 2,271 parts In-Stock

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Digiode

USA . 555 parts In-Stock

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555

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TANS Electronics

Latvia . 7,580 parts In-Stock

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7,580

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Problanco Electronics

Mexico . 4,579 parts In-Stock

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4,579

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SupplyDigital Components

Austria . 2,236 parts In-Stock

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Corphita

USA . 792 parts In-Stock

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792

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Kulean Microsystems

USA . 491 parts In-Stock

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491

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UHIMA Technologies

Türkiye . 371 parts In-Stock

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Corohmni

South Africa . 120 parts In-Stock

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Overview

Experience unmatched performance and reliability with the MC1496BDR2 by Onsemi. As a leader in consumer ICs, Onsemi delivers cutting-edge technology that exceeds industry standards. The MC1496BDR2 offers unparalleled versatility and precision for a wide range of applications. From automotive to industrial, this small outline package ensures seamless integration and optimal performance. Trust Onsemi's commitment to quality and innovation, and elevate your projects to new heights with the MC1496BDR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, making it suitable for various environments and applications.

Surface Mount: Yes

Surface mount capability enables easy installation on PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and facilitates proper alignment during mounting.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand demanding conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good conductivity and solderability, enhancing the reliability of connections.

Width: 3.9 mm

The compact width of the IC allows for space-efficient PCB designs and integration into small devices.

Minimum Supply Voltage (Vsup): 12 V

The minimum supply voltage of 12 V ensures compatibility with various power sources and operational stability.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets stringent industry standards for performance and reliability in automotive environments.

Terminal Form: GULL WING

The gull wing terminal form provides a secure mechanical connection and facilitates automated assembly processes.

Technical Specifications

Other Function Consumer ICs MC1496BDR2 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

MC1496BDR2 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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