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TFP410PAPR

Texas Instruments

TFP410PAPR by Texas Instruments

TFP410PAPR by Texas Instruments is a consumer IC with 64 terminals in a square package. It operates b/w 0-70°C, with supply voltage of 3-3.6V. This CMOS technology chip is ideal for applications requiring fine pitch and thin profile designs.

Median Price

$4.824

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 45,328 parts In-Stock

1+ parts

$5.610

100+ parts

$4.574

1k+ parts

$3.049

10k+ parts

-

45,328

$5.610

$4.574

$3.049

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Mouser Electronics

USA . 2,048 parts In-Stock

1+ parts

$9.750

100+ parts

$6.310

1k+ parts

$4.820

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2,048

$9.750

$6.310

$4.820

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Future Electronics

Canada . 8,000 parts In-Stock

1+ parts

-

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$2.900

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8,000

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$2.900

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Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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$4.037

10k+ parts

$3.908

2,000

-

-

$4.037

$3.908

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.622

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-

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100

$4.622

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Digiode

USA . 2,876 parts In-Stock

1+ parts

$5.330

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2,876

$5.330

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Maritex

Poland . 580 parts In-Stock

1+ parts

$5.815

100+ parts

$3.543

1k+ parts

$2.823

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580

$5.815

$3.543

$2.823

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Cyclops Electronics Ltd

UK . 19,273 parts In-Stock

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Vyrian

USA . 15,825 parts In-Stock

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15,825

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Chip Stock

USA . 8,800 parts In-Stock

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8,800

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Distributors (Availability)

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Corohmni

South Africa . 753 parts In-Stock

1+ parts

$0.294

100+ parts

-

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753

$0.294

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Parana Technologies

USA . 558 parts In-Stock

1+ parts

$0.382

100+ parts

-

1k+ parts

$1.578

10k+ parts

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558

$0.382

-

$1.578

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DigiPath Technology Company

USA . 461 parts In-Stock

1+ parts

$0.420

100+ parts

$0.387

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-

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461

$0.420

$0.387

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IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$0.429

100+ parts

-

1k+ parts

$0.386

10k+ parts

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1,705

$0.429

-

$0.386

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ChromeModa Solutions

Germany . 443 parts In-Stock

1+ parts

$0.429

100+ parts

$0.352

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-

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443

$0.429

$0.352

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.366

100+ parts

$2.248

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$2.248

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1,000

$2.366

$2.248

$2.248

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Ampacity Inc.

Singapore . 15,958 parts In-Stock

1+ parts

$3.430

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15,958

$3.430

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Continental Prestige Electronics

USA . 2,305 parts In-Stock

1+ parts

$4.622

100+ parts

-

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10k+ parts

$4.529

2,305

$4.622

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-

$4.529

Corphita

USA . 2,687 parts In-Stock

1+ parts

$5.049

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-

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2,687

$5.049

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Semicontronic

India . 15,788 parts In-Stock

1+ parts

$7.470

100+ parts

$7.283

1k+ parts

$7.246

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15,788

$7.470

$7.283

$7.246

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Formix International (Excess)

India . 6,507 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,483 parts In-Stock

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5,483

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

1+ parts

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$5.350

1k+ parts

$4.756

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1,000

-

$5.350

$4.756

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Assy Fe

Spain . 1,000 parts In-Stock

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Argo Parts USA

USA . 702 parts In-Stock

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702

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Kepictronics

USA . 616 parts In-Stock

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616

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Futuretech Components

Singapore . 210 parts In-Stock

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210

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Lixinc

USA . 202 parts In-Stock

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202

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Robosynatics

Brazil . 150 parts In-Stock

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$2.819

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$2.819

10k+ parts

$2.819

150

-

$2.819

$2.819

$2.819

Lucentia Tech

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$2.819

1k+ parts

$2.819

10k+ parts

$2.819

150

-

$2.819

$2.819

$2.819

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$4.529

1k+ parts

$4.391

10k+ parts

$4.298

50

-

$4.529

$4.391

$4.298

Overview

Discover the innovative TFP410PAPR by Texas Instruments, a top-of-the-line Consumer Circuit IC designed with precision and quality in mind. With a package body made of durable PLASTIC/EPOXY material and a sleek SQUARE shape, this IC offers reliability and longevity. Ideal for a wide range of applications, this versatile IC from Texas Instruments delivers exceptional performance, making it a valuable addition to any project. Unlock endless possibilities with the TFP410PAPR and experience the superior quality and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and helps in reducing the overall weight of the product.

Surface Mount: YES

The surface mount feature makes this IC easy to install and allows for efficient use of PCB space.

Package Shape: SQUARE

The square package shape ensures uniformity in design and facilitates easier handling during manufacturing and assembly processes.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, this product is well-suited for applications in consumer electronics, ensuring reliable performance for end-users.

No. of Terminals: 64

With 64 terminals, this IC offers a high level of connectivity and versatility for various circuit configurations.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The diverse package styles available make this IC adaptable to different design requirements and thermal management needs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stability and reliability, even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions, making it suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold as terminal finish provides excellent conductivity and corrosion resistance for longer lifespan.

Terminal Position: QUAD

The quad terminal position enhances the IC's connectivity and enables efficient signal routing within the circuit.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in achieving a compact form factor and simplifies the integration of the IC into space-constrained designs.

Width: 10 mm

The width of 10mm allows for easy compatibility with standard PCB layouts and ensures seamless integration into existing circuit designs.

Minimum Supply Voltage (Vsup): 3 V

With a low minimum supply voltage requirement, this IC is energy-efficient and suitable for battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and prevents overheating during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C guarantees reliable solder joints and enhances the overall durability of the IC.

Length: 10 mm

The length of 10mm contributes to the compact size of the IC, making it ideal for space-constrained applications.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption, high speed, and noise immunity, making it suitable for various digital applications.

Terminal Form: GULL WING

The gull-wing terminal form provides ease of soldering and ensures reliable electrical connections in the circuit.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and enables efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC can withstand moderate exposure to moisture during storage and handling.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V provides flexibility in power supply options and accommodates a wide range of operating conditions.

Technical Specifications

Other Function Consumer ICs TFP410PAPR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TFP410PAPR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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