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TFP410PAPRG4

Texas Instruments

TFP410PAPRG4 by Texas Instruments

TFP410PAPRG4 by Texas Instruments is a consumer IC with 64 terminals in a square package. It operates b/w 0-70°C, with supply voltage ranging from 3-3.6V. This CMOS technology IC is ideal for applications requiring thin profile and fine pitch components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,024 parts In-Stock

1+ parts

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6,024

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Digiode

USA . 3,967 parts In-Stock

1+ parts

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3,967

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 965 parts In-Stock

1+ parts

$1.588

100+ parts

-

1k+ parts

$2.222

10k+ parts

-

965

$1.588

-

$2.222

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DigiPath Technology Company

USA . 1,824 parts In-Stock

1+ parts

$1.748

100+ parts

$1.608

1k+ parts

-

10k+ parts

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1,824

$1.748

$1.608

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ChromeModa Solutions

Germany . 5,238 parts In-Stock

1+ parts

$1.784

100+ parts

$1.463

1k+ parts

-

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5,238

$1.784

$1.463

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IDEA Electronic Components Group

UK . 2,313 parts In-Stock

1+ parts

$1.784

100+ parts

-

1k+ parts

$1.606

10k+ parts

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2,313

$1.784

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$1.606

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AZTECH Wire

Italy . 459 parts In-Stock

1+ parts

$7.252

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459

$7.252

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One Stop Electronics

USA . 1,060 parts In-Stock

1+ parts

$13.800

100+ parts

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1,060

$13.800

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Corphita

USA . 1,533 parts In-Stock

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1,533

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Overview

Upgrade your consumer electronics with the high-quality TFP410PAPRG4 by Texas Instruments. This innovative consumer circuit IC in a sleek square package offers exceptional performance and reliability for a wide range of applications. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product delivers superior value and benefits to meet your needs. Experience the advantages of cutting-edge technology without sacrificing quality with the TFP410PAPRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for a variety of consumer electronic applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer circuits, this IC is optimized for performance in applications such as home electronics, appliances, and entertainment devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable for consumer applications.

Technical Specifications

Other Function Consumer ICs TFP410PAPRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TFP410PAPRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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