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TLV320AIC23BIRHDG4

Texas Instruments

TLV320AIC23BIRHDG4 by Texas Instruments

TLV320AIC23BIRHDG4 by Texas Instruments is a consumer IC with 28 terminals, operating at -40 to 85°C. It has power supplies of 1.5-3.3V and a max supply current of 26mA. This chip carrier is ideal for industrial applications requiring a compact design and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,564 parts In-Stock

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6,564

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Digiode

USA . 142 parts In-Stock

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142

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ACDS - Activité Composants Distribution Service

France . 63 parts In-Stock

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63

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.913

100+ parts

$1.741

1k+ parts

$1.569

10k+ parts

-

2,500

$1.913

$1.741

$1.569

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Parana Technologies

USA . 1,420 parts In-Stock

1+ parts

$2.212

100+ parts

$205.385

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$1.990

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1,420

$2.212

$205.385

$1.990

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DigiPath Technology Company

USA . 862 parts In-Stock

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$2.435

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862

$2.435

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ChromeModa Solutions

Germany . 3,497 parts In-Stock

1+ parts

$2.485

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$2.038

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3,497

$2.485

$2.038

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IDEA Electronic Components Group

UK . 1,171 parts In-Stock

1+ parts

$2.485

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$2.236

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$2.485

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$2.236

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One Stop Electronics

USA . 1,239 parts In-Stock

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$2.800

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1,239

$2.800

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Corohmni

South Africa . 471 parts In-Stock

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$3.435

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471

$3.435

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Ampacity Inc.

Singapore . 966 parts In-Stock

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$4.800

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966

$4.800

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AZTECH Wire

Italy . 259 parts In-Stock

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$8.739

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259

$8.739

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Semicontronic

India . 1,310 parts In-Stock

1+ parts

$13.800

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$13.455

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$13.386

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1,310

$13.800

$13.455

$13.386

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QUARKTWIN TECHNOLOGY LTD

USA . 4,099 parts In-Stock

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Microchip USA

USA . 2,664 parts In-Stock

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Argo Parts USA

USA . 1,802 parts In-Stock

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Corphita

USA . 1,622 parts In-Stock

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1,622

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Perfect Parts

USA . 141 parts In-Stock

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141

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Continental Prestige Electronics

USA . 36 parts In-Stock

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Assy Fe

Spain . 10 parts In-Stock

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10

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Overview

Enhance your consumer electronics with the TLV320AIC23BIRHDG4 by Texas Instruments, a high-quality and reliable solution for all your audio processing needs. Designed by a trusted industry leader, this IC offers exceptional performance and versatility in a compact package. Whether you're looking to improve sound quality in headphones, speakers, or other audio devices, this chip delivers outstanding value, making it the perfect choice for your next project. Upgrade your audio experience today with the TLV320AIC23BIRHDG4 and enjoy top-notch sound performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

The square package shape offers better space utilization on the PCB, making it suitable for compact designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring optimal performance and compatibility with various devices.

Power Supplies (V): 1.5,3.3

The ability to operate at multiple power supply voltages provides flexibility in different applications.

No. of Terminals: 28

With 28 terminals, the IC offers ample connectivity options for interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles cater to different thermal and space requirements, making it versatile for diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for a wide range of operating environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position enables efficient routing of connections on the PCB, optimizing signal integrity.

Maximum Seated Height: 1 mm

The low maximum seated height allows for slim and compact designs, ideal for space-constrained applications.

Technical Specifications

Other Function Consumer ICs TLV320AIC23BIRHDG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.42V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TLV320AIC23BIRHDG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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