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TLV320AIC23BIPWRG4

Texas Instruments

TLV320AIC23BIPWRG4 by Texas Instruments

TLV320AIC23BIPWRG4 by Texas Instruments is a consumer IC with 28 terminals, operating at -40 to 85°C. It has power supplies of 1.5-3.3V and terminal finish of NiPdAu. This IC is used in industrial applications requiring small outline packaging and thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 5,220 parts In-Stock

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Digiode

USA . 4,838 parts In-Stock

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Vyrian

USA . 3,813 parts In-Stock

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3,813

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Bristol Electronics

USA . 1,310 parts In-Stock

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1,310

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semi Source

USA . 29 parts In-Stock

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29

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$0.544

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292

$0.544

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Modulus Dynamics

Lithuania . 20 parts In-Stock

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$3.096

100+ parts

$3.096

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$3.096

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20

$3.096

$3.096

$3.096

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Parana Technologies

USA . 1,940 parts In-Stock

1+ parts

$3.157

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$3.675

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1,940

$3.157

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$3.675

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DigiPath Technology Company

USA . 1,753 parts In-Stock

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$3.476

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$3.198

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$3.476

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ChromeModa Solutions

Germany . 6,105 parts In-Stock

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$3.547

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$2.909

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$3.547

$2.909

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IDEA Electronic Components Group

UK . 1,796 parts In-Stock

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$3.547

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$3.192

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Ampacity Inc.

Singapore . 150 parts In-Stock

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$11.800

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AZTECH Wire

Italy . 734 parts In-Stock

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$15.202

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Semicontronic

India . 508 parts In-Stock

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$17.800

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$17.355

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$17.266

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508

$17.800

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One Stop Electronics

USA . 1,212 parts In-Stock

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$21.800

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QUARKTWIN TECHNOLOGY LTD

USA . 12,817 parts In-Stock

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Perfect Parts

USA . 8,960 parts In-Stock

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Microchip USA

USA . 2,804 parts In-Stock

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Continental Prestige Electronics

USA . 1,831 parts In-Stock

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Argo Parts USA

USA . 992 parts In-Stock

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Corphita

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902

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Experience unparalleled audio quality and performance with the TLV320AIC23BIPWRG4 by Texas Instruments, a leading manufacturer in the industry. This consumer IC offers versatile applications in various devices, providing exceptional sound reproduction and clarity. Elevate your audio experience with this compact and reliable product, delivering superior value and benefits to customers seeking top-notch performance. Trust Texas Instruments for cutting-edge technology and innovative solutions that enhance your audio systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and insulation for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes it easier for automated assembly processes, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, optimizing layout and design.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility with a wide range of electronic devices.

Power Supplies (V): 1.5, 3.3

Supports multiple power supply options, allowing flexibility in usage and compatibility with various systems.

No. of Terminals: 28

Sufficient number of terminals for connectivity and functionality in complex electronic circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on circuit boards and enables slim and sleek device designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows for usage in extreme cold environments without performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal position offers increased stability and connectivity for secure integration into electronic systems.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact placement on circuit boards and reduces overall device thickness.

Width: 4.4 mm

Narrow width enables efficient use of space on circuit boards and facilitates compact device designs.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for effective soldering and assembly processes without compromising quality.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering and reliable connections during assembly.

Length: 9.7 mm

Compact length allows for efficient placement on circuit boards and contributes to overall device miniaturization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating environments.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and secure soldering connections for durability.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on circuit boards and facilitates compact device designs.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance supports compatibility with a wide range of power sources for versatile applications.

Technical Specifications

Other Function Consumer ICs TLV320AIC23BIPWRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.42V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC23BIPWRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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