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TLV320AIC23BRHDRG4

Texas Instruments

TLV320AIC23BRHDRG4 by Texas Instruments

TLV320AIC23BRHDRG4 by Texas Instruments is a consumer IC with 28 terminals, operating at 0-70°C. It has power supplies of 1.5-3.3V and a max supply current of 26mA. This chip carrier is suitable for various consumer circuit applications due to its compact size and nickel palladium gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,622 parts In-Stock

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3,622

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Chip Stock

USA . 2,854 parts In-Stock

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2,854

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Digiode

USA . 1,943 parts In-Stock

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1,943

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 326 parts In-Stock

1+ parts

$2.794

100+ parts

-

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326

$2.794

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Parana Technologies

USA . 799 parts In-Stock

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$2.829

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$3.316

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799

$2.829

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$3.316

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DigiPath Technology Company

USA . 1,745 parts In-Stock

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$3.115

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1,745

$3.115

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ChromeModa Solutions

Germany . 6,062 parts In-Stock

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$3.179

100+ parts

$2.607

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6,062

$3.179

$2.607

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IDEA Electronic Components Group

UK . 1,905 parts In-Stock

1+ parts

$3.179

100+ parts

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$2.861

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1,905

$3.179

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$2.861

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AZTECH Wire

Italy . 557 parts In-Stock

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$12.036

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557

$12.036

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Ampacity Inc.

Singapore . 615 parts In-Stock

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$13.800

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615

$13.800

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One Stop Electronics

USA . 1,225 parts In-Stock

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$18.800

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1,225

$18.800

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Continental Prestige Electronics

USA . 3,837 parts In-Stock

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Corphita

USA . 3,310 parts In-Stock

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3,310

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Argo Parts USA

USA . 2,919 parts In-Stock

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2,919

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 1,382 parts In-Stock

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1,382

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Overview

Unlock a world of high-quality audio experiences with the TLV320AIC23BRHDRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers excellence in consumer ICs like this one, offering unparalleled value and benefits to customers. Ideal for various applications, this chip carrier with a very thin profile ensures top-notch performance and reliability. Elevate your audio projects with ease, thanks to the innovative technology and superior design of the TLV320AIC23BRHDRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product more space-efficient and easier to assemble.

Power Supplies (V): 1.5,3.3

Having multiple power supply options allows for versatility in different operating environments, ensuring compatibility with a variety of systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh conditions and perform reliably in challenging environments.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement allows for efficient power consumption and extends the product's battery life.

Moisture Sensitivity Level (MSL): 2

A low moisture sensitivity level indicates that the product is less prone to damage from exposure to moisture, ensuring long-term reliability.

Technical Specifications

Other Function Consumer ICs TLV320AIC23BRHDRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.42V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC23BRHDRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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